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Chinese National Standard Category: Metal processing property test method

English Title: Test methods of precious metal pastes used for thick film microelectronics--Test of solderability and solderleaching resistance
Chinese Title: 厚膜微电子技术用贵金属浆料测试方法 可焊性、耐焊性试验
Standard No.: GB/T 17473.7-1998
Category No.: H23
Issued by: State Qualtiy Technical Supervision Bureau
Issued on: 1998-08-19
Implemented on: 1999-3-1
Status: superseded
Superseded by:GB/T 17473.7-2008 Test methods of precious metals pastes used for microelectronics - Determination of solderability and solderelaching resistance
Superseded on:2008-9-1
Abolished on:2008-09-01
Superseding:
Word Count:2500 words
Similar Standards: GB/T 15615-1995   GB 7733-1987   GB 3246-1982   GB/T 239.1-2023   GB/T 239.2-2023   GB/T 17473.7-2022   GB/T 24524-2021   GB/T 24183-2021   GB/T 2976-2020   GB/T 244-2020   GB/T 4156-2020   GB/T 25048-2019   GB/T 34477-2017   GB/T 246-2017   GB/T 32976-2016   GB/T 245-2016   GB/T 235-2013   GB/T 238-2013   YS/T 799-2012   GB/T 239.2-2012  
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