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Standard
| T/WXICS 001-2024 Performance requirements and testing methods for conductive adhesives of semiconductors (English Version) |
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Introduction of T/WXICS 001-2024
本文件规定了半导体芯片封装用导电胶（以下简称“导电胶”）性能要求及各项性能的测试方法。
本文件适用于在有机聚合物中添加以银为导电填料粒子的半导体芯片封装用导电胶的测试及验收。
Contents of T/WXICS 001-2024