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| International Standard Category: Semiconducting materials |
GB/T 8646-1998 Fine aluminum-1% silicon wire for semiconductor lend-bonding
半导体键合铝-1%硅细丝 ;
| Category No.: | 29.045 | Valid Status: | abolished |
| Issued Organization: | State Qualtiy Technical Supervision Bureau | Issued Date: | 1998-07-15 |
| Implemented Date: | 1999-2-1 | Abolished Date: | 2007-09-29 |
| Superseded Standard.: | YS/T 543-2006 Fine aluminum-1% silicon wire for semiconductor lend-bonding |
Superseded Date: | 2006-10-11 |
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