2024-11-21 18.222.166.127
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Code of China
Chinese National Standard List: Semiconductor discrete devices in general

T/CIE 145-2022 Measurement method of radiation induced traps by deep level transient spectroscopy 
  Issued on: 2022-12-31   Price(USD): 225.0
T/CIE 116-2021 Fault tree analysis method and procedure of electronic components 
  Issued on: 2021-11-22   Price(USD): 375.0
T/CIE 147-2022 Technical specification for evaluation of space TWT accelerated life test 
  Issued on:   Price(USD): 225.0
T/CIE 119-2021 Test method and procedure of atmospheric-neutron induced single event effects in semiconductor devices 
  Issued on: 2021-11-22   Price(USD): 225.0
GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components 
  Issued on: 2024-3-15   Price(USD): 330.0
GB/T 4937.34-2024 Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling 
  Issued on: 2024-3-15   Price(USD): 210.0
GB/T 4937.26-2023 Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM） 
  Issued on: 2023-9-7   Price(USD): 800.0
GB/T 4587-2023 Semiconductor devices—Discrete devices—Part 7:Bipolar transistors 
  Issued on: 2023-9-7   Price(USD): 1275.0
GB/T 42709.19-2023 Semiconductor devices―Micro-electromechanical devices―Part 19:Electronic compasses 
  Issued on: 2023-08-06   Price(USD): 435.0
GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage 
  Issued on: 2023-05-23   Price(USD): 180.0
GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27: Electrostatic discharge(ESD) sensitivity testing—Machine model(MM)  
  Issued on: 2023-05-23   Price(USD): 255.0
GB/T 42709.7-2023 Semiconductor devices—Micro-electromechanical devices—Part 7: MEMS BAW filter and duplexer for radio frequency control and selection  
  Issued on: 2023-05-23   Price(USD): 375.0
GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices（externally induced）  
  Issued on: 2023-05-23   Price(USD): 120.0
GB/T 4937.31-2023 Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices（internally induced）  
  Issued on: 2023-05-23   Price(USD): 120.0
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life 
  Issued on: 2023-05-23   Price(USD): 255.0
GB/T 42706.5-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 5：Die and wafer devices  
  Issued on: 2023-05-23   Price(USD): 285.0
GB/T 42706.2-2023 Electronic components—Long-term storage of electronic semiconductor devices—Part 2：Deterioration mechanisms 
  Issued on: 2023-05-23   Price(USD): 285.0
GB/T 42709.5-2023 Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches 
  Issued on: 2023-05-23   Price(USD): 495.0
GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17:Neutron irradiation 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30:Preconditioning of non-hermetic surface mount devices prior to reliability testing 
  Issued on: 2018-09-17   Price(USD): 130.0
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