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Code of China
Chinese National Standard List: Semiconductor discrete devices in general

GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17:Neutron irradiation 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30:Preconditioning of non-hermetic surface mount devices prior to reliability testing 
  Issued on: 2018-09-17   Price(USD): 130.0
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity） 
  Issued on: 2018-09-17   Price(USD): 160.0
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 
  Issued on: 2018-09-17   Price(USD): 310.0
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 
  Issued on: 2018-09-17   Price(USD): 250.0
GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18:Ionizing radiation(total dose) 
  Issued on: 2018-09-17   Price(USD): 130.0
GB/T 4937.12-2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength 
  Issued on: 2018-09-17   Price(USD): 250.0
GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 
  Issued on: 2018-09-17   Price(USD): 430.0
GB/T 249-2017 The rule of type designation for discrete semiconductor devices 
  Issued on: 2017-05-12   Price(USD): 70.0
DB52/T 1104-2016 Junction-to-case thermal resistance transient test method of semiconductor devices 
  Issued on: 2016-04-01   Price(USD):
GB/T 29827-2013 Information security technology—Trusted computing specification—Motherboard function and interface of trusted platform 
  Issued on: 2013-11-12   Price(USD): 600.0
GB/T 15852.2-2012 Information technology—Security techniques—Message Authentication Codes (MACs)—Part 2:Mechanisms using a dedicated hash-function 
  Issued on: 2012-12-31   Price(USD): 390.0
GB/T 4937.4-2012 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) 
  Issued on: 2012-11-5   Price(USD): 120.0
GB/T 4937.3-2012 Semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination 
  Issued on: 2012-11-5   Price(USD): 90.0
GB/T 18910.11-2012 Liquid crystal display devices - Part 1-1: Terminology and symbols 
  Issued on: 2012-11-5   Price(USD): 450.0
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