2023-10-5 44.197.111.121
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Code of China
Chinese National Standard List: Semiconductor discrete devices in general

T/CIE 116-2021 Fault tree analysis method and procedure of electronic components 
  Issued on: 2021-11-22   Price(USD): 375.0
T/CIE 119-2021 Test method and procedure of atmospheric-neutron induced single event effects in semiconductor devices 
  Issued on: 2021-11-22   Price(USD): 225.0
GB/T 42709.19-2023 Semiconductor devices―Micro-electromechanical devices―Part 19:Electronic compasses 
  Issued on: 2023-08-06   Price(USD): 435.0
GB/T 42709.7-2023 Semiconductor devices—Micro-electromechanical devices—Part 7: MEMS BAW filter and duplexer for radio frequency control and selection  
  Issued on: 2023-05-23   Price(USD): 375.0
GB/T 4937.31-2023 Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices（internally induced）  
  Issued on: 2023-05-23   Price(USD): 120.0
GB/T 42709.5-2023 Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches 
  Issued on: 2023-05-23   Price(USD): 495.0
GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17:Neutron irradiation 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30:Preconditioning of non-hermetic surface mount devices prior to reliability testing 
  Issued on: 2018-09-17   Price(USD): 130.0
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity） 
  Issued on: 2018-09-17   Price(USD): 160.0
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 
  Issued on: 2018-09-17   Price(USD): 310.0
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 
  Issued on: 2018-09-17   Price(USD): 250.0
GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18:Ionizing radiation(total dose) 
  Issued on: 2018-09-17   Price(USD): 130.0
GB/T 4937.12-2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength 
  Issued on: 2018-09-17   Price(USD): 250.0
GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 
  Issued on: 2018-09-17   Price(USD): 430.0
GB/T 249-2017 The rule of type designation for discrete semiconductor devices 
  Issued on: 2017-05-12   Price(USD): 70.0
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