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Code of China
Chinese National Standard List: Microcircuit in general

GB/T 41852-2022 Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures 
  Issued on: 2022-10-12   Price(USD): 225.0
GB/T 34900-2017 Micro-electromechanical system technology-Measuring method for residual strain measurements of MEMS microstructures using an optical interferometer 
  Issued on: 2017-11-01   Price(USD): 220.0
GB/T 41853-2022 Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement 
  Issued on: 2022-10-12   Price(USD): 315.0
GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits 
  Issued on: 2021-03-09   Price(USD): 6450.0
GB/T 38762.2-2020 Geometrical product specifications(GPS)—Dimensional tolerancing—Part 2:Dimensions other than linear or angular sizes 
  Issued on: 2020-04-28   Price(USD): 315.0
GB/T 38762.3-2020 Geometrical product specifications(GPS)—Dimensional tolerancing—Part 3:Angular sizes 
  Issued on: 2020-04-28   Price(USD): 315.0
GB/T 38762.1-2020 Geometrical product specifications(GPS)—Dimensional tolerancing—Part 1:Linear sizes 
  Issued on: 2020-04-28   Price(USD): 630.0
GB/T 38446-2020 Micro-electromechanical system technology—Test methods for tensile property measurement of strip thin films 
  Issued on: 2020-03-06   Price(USD): 120.0
GB/T 38447-2020 Micro-electromechanical system technology—Fatigue testing method of MEMS structure using resonant vibration 
  Issued on: 2020-03-06   Price(USD): 250.0
GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4:Coding system and classification into forms of package outlines for semiconductor device packages 
  Issued on: 2019-08-30   Price(USD): 250.0
GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits 
  Issued on: 2018-09-17   Price(USD): 550.0
GB/T 36614-2018 Integrated circuits—Memory devices pin configuration 
  Issued on: 2018-09-17   Price(USD): 250.0
GB/T 35005-2018 Test methods for flip chip integrated circuits 
  Issued on: 2018-03-15   Price(USD): 290.0
GB/T 35010.8-2018 Semiconductor die products—Part 8:EXPRESS model schema for data exchange 
  Issued on: 2018-03-15   Price(USD): 370.0
GB/T 35010.1-2018 Semiconductor die products—Part 1:Requirements for procurement and use 
  Issued on: 2018-03-15   Price(USD): 550.0
GB/T 35010.7-2018 Semiconductor die products—Part 7:XML schema for data exchange 
  Issued on: 2018-03-15   Price(USD): 490.0
GB/T 35010.5-2018 Semiconductor die products—Part 5:Requirements for concerning electrical simulation 
  Issued on: 2018-03-15   Price(USD): 160.0
GB/T 35010.4-2018 Semiconductor die products—Part 4: Requirements for die users and suppliers 
  Issued on: 2018-03-15   Price(USD): 250.0
GB/T 35010.3-2018 Semiconductor die products—Part 3: Guide for handling, packing and storage 
  Issued on: 2018-03-15   Price(USD): 430.0
GB/T 35010.2-2018 Semiconductor die products—Part 2:Exchange data formats 
  Issued on: 2018-03-15   Price(USD): 870.0
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