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| Chinese National Standard Category: Microcircuit in general |
| English Title: | Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits |
| Chinese Title: | 半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值 |
| Standard No.: | GB/T 15879.5-2018 |
| Category No.: | L55 |
| Issued by: | SAMR; SAC |
| Issued on: | 2018-09-17 |
| Implemented on: | 2019-4-1 |
| Status: | valid |
| Superseded by: | |
| Superseded on: | |
| Abolished on: | |
| Superseding: | GB/T 15879-1995 Mechanical standardization of semiconductor devices Part 5: Recommendation applying to tape automated bonding (TAB) of integrated circuits |
| Word Count: | 18500 words |
| Similar Standards: | GB/T 15431-1995 GB/T 34900-2017 GB/T 43538-2023 GB/T 43061-2023 GB/T 43536.1-2023 GB/Z 43510-2023 GB/T 43040-2023 GB/T 42972-2023 GB/T 43027-2023 GB/T 43063-2023 GB/T 15879.604-2023 GB/T 42706.1-2023 GB/T 41852-2022 GB/T 41853-2022 GB/T 7092-2021 GB/T 38762.2-2020 GB/T 38762.3-2020 GB/T 38762.1-2020 GB/T 38446-2020 GB/T 38447-2020 |
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