2024-11-22 3.136.23.132
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
GB 10243-1988 prepreg for use as bonding sheet material in the fabrication of multilayer printed boards 100.0 via email in 1~3 business day superseded,2000-1-1,1989-7-1
GB 10244-1988 Specification for printed boards for broardcasting TV receivers 130.0 via email in 1~3 business day valid,,1989-7-1
GB 13555-1992 Flexible copper-clad polyimide film for printed circuits 90.0 via email in 1~3 business day superseded,,1993-4-1
GB 13556-1992 Flexible copper - Clad polyester film for printed circuits 60.0 via email in 1~3 business day superseded2019-01-01,2019-1-1,1993-4-1
GB 1360-1978 Network for printed circuits 15.0 via email in 1~3 business day superseded,1998-12-1,1978-7-1
GB 2036-1980 Printed circuits--Terminology and definitions 250.0 via email in 1~3 business day superseded,1995-8-1,1981-5-1
GB 4588.1-1984 Specification for single and double sided printed boards with plain holes 260.0 via email in 1~3 business day superseded,1996-10-1,1985-5-1
GB 4588.2-1984 Specification for single and double sided printed boards with plated-through holes 375.0 via email in 1~3 business day superseded,1996-10-1,1985-5-1
GB 4588.4-1988 Specification for multilayer printed boards 270.0 via email in 1~3 business day superseded,1997-8-1,1989-7-1
GB 4724-1992 Epoxide cellulose paper copper-clad laminated sheets for printed circuits 90.0 via email in 1~3 business day superseded2018-02-01 ,2018-2-1,1993-4-1
GB 4725-1992 Epoxide woven glass fabric copper-clad laminated sheets for printed circuits 60.0 via email in 1~3 business day superseded,2022-10-1,1993-4-1
GB 9491-1988 Liquid flux for soldering 410.0 via email in 1~3 business day superseded,,
GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards 140.0 via email in 1~3 business day superseded,2022-10-1,1991-10-1
GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards 124.0 via email in 1~3 business day valid,,1991-10-1
GB/T 12631-1990 Test method for resistance of conductor of printed boards 60.0 via email in 1~3 business day abolished2017-12-01,2017-12-1,1991-10-1
GB/T 12631-2017 Test method for resistance of conductors of printed boards 100.0 via email in 1~3 business day valid,,2017-12-1
GB/T 13555-2017 Copper-clad polyimide film laminates for flexible printed circuits 240.0 via email in 1~3 business day valid,,2019-1-1
GB/T 13556-2017 Copper-clad polyester film laminates for flexible printed circuits 210.0 via email in 1~3 business day valid,,2019-1-1
GB/T 13557-1992 Test methods for flexible copper - Clad material for printed circuits 105.0 via email in 1~3 business day abolished2018-02-01,2018-2-1,1993-4-1
GB/T 13557-2017 Test methods for copper-clad material for flexible printed circuits 600.0 via email in 1~5 business day valid,,2018-2-1
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GB 10243-1988 prepreg for use as bonding sheet material in the fabrication of multilayer printed boards 
  Issued on:   Price(USD): 100.0
GB 10244-1988 Specification for printed boards for broardcasting TV receivers 
  Issued on:   Price(USD): 130.0
GB 13555-1992 Flexible copper-clad polyimide film for printed circuits 
  Issued on: 1992-07-08   Price(USD): 90.0
GB 13556-1992 Flexible copper - Clad polyester film for printed circuits 
  Issued on: 1992-7-8   Price(USD): 60.0
GB 1360-1978 Network for printed circuits 
  Issued on:   Price(USD): 15.0
GB 2036-1980 Printed circuits--Terminology and definitions 
  Issued on:   Price(USD): 250.0
GB 4588.1-1984 Specification for single and double sided printed boards with plain holes 
  Issued on:   Price(USD): 260.0
GB 4588.2-1984 Specification for single and double sided printed boards with plated-through holes 
  Issued on:   Price(USD): 375.0
GB 4588.4-1988 Specification for multilayer printed boards 
  Issued on:   Price(USD): 270.0
GB 4724-1992 Epoxide cellulose paper copper-clad laminated sheets for printed circuits 
  Issued on: 1992-7-8   Price(USD): 90.0
GB 4725-1992 Epoxide woven glass fabric copper-clad laminated sheets for printed circuits 
  Issued on: 1992-7-8   Price(USD): 60.0
GB 9491-1988 Liquid flux for soldering 
  Issued on:   Price(USD): 410.0
GB/T 12629-1990 Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards 
  Issued on: 1990-1-2   Price(USD): 140.0
GB/T 12630-1990 Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards 
  Issued on: 1990-1-2   Price(USD): 124.0
GB/T 12631-1990 Test method for resistance of conductor of printed boards 
  Issued on: 1990-1-2   Price(USD): 60.0
GB/T 12631-2017 Test method for resistance of conductors of printed boards 
  Issued on: 2017-05-31   Price(USD): 100.0
GB/T 13555-2017 Copper-clad polyimide film laminates for flexible printed circuits 
  Issued on: 2017-12-29   Price(USD): 240.0
GB/T 13556-2017 Copper-clad polyester film laminates for flexible printed circuits 
  Issued on: 2017-12-29   Price(USD): 210.0
GB/T 13557-1992 Test methods for flexible copper - Clad material for printed circuits 
  Issued on: 1992-7-8   Price(USD): 105.0
GB/T 13557-2017 Test methods for copper-clad material for flexible printed circuits 
  Issued on: 2017-07-31   Price(USD): 600.0
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