Standard No.:	T/TMAC 232-2025
Chinese Name:	多晶金刚石热沉片
Chinese Classification:	L56    Semiconductor integrated circuit
Professional Classification:	T/    Social Organization Standard
ICS Classification:	31.080.01 31.080.01    Semiconductor devices in general 31.080.01
Source Content Issued by:	TMAC
Issued on:	2025-09-10
Implemented on:	2025-9-10
Status:	valid
Target Language:	English
File Format:	PDF

本文件规定了多晶金刚石热沉片的技术要求、试验方法、检验规则以及标志、包装、运输和贮存等内容。
本文件适用于多晶金刚石热沉片的生产、设计与检测。