2024-12-21 3.144.121.109
Code of China Chinese Classification Professional Classification ICS Classification Latest Value-added Services

Code of China
Chinese National Standard List: Dedicated processing equipment

GB/T 43972-2024 Remote operation and maintenance of integrated circuit packaging equipment—Status monitoring 
  Issued on: 2024-4-25   Price(USD): 390.0
GB/T 43725-2024 Direct writing imaging exposure equipment 
  Issued on: 2024-3-15   Price(USD): 270.0
GB/T 43796-2024 Remote operation and maintenance of integrated circuit packaging equipment—Data acquisition 
  Issued on: 2024-3-15   Price(USD): 315.0
GB/T 15862-2012 General specification of ion implantation equipment 
  Issued on: 2012-11-5   Price(USD): 210.0
GB/T 15861-2012 General specification of ion beam etching system 
  Issued on: 2012-11-5   Price(USD): 210.0
SJ 2529-1984  
  Issued on:   Price(USD):
SJ 1656-1980  
  Issued on:   Price(USD): 180.0
SJ/T 11215-1999 Oeneral specifications of automatic taping machine for electronic components 
  Issued on: 1999-08-26   Price(USD): 130.0
SJ/T 211.6-1999 Design documents for special equipment for electronic industry-Part 6:Revision of design documents 
  Issued on: 1999-08-26   Price(USD): 90.0
GB/T 16880-1997 Guidelines for photomask defect classification and size definition 
  Issued on: 1997-6-20   Price(USD): 90.0
GB/T 16878-1997 Specification for metrology pattern cells for integrated circuit manufacture 
  Issued on: 1997-6-20   Price(USD): 180.0
GB/T 16879-1997 Guidelines for precision and accuracy expression for mask writing equipment 
  Issued on: 1997-6-20   Price(USD): 120.0
SJ/T 31253-1994 Requirements of Readiness and Methods of Inspection and Assessment for Automatic Non-inductance Capacitor Winding Machines 
  Issued on: 1994-04-15   Price(USD): 164.0
SJ/T 31211-1994 Requirements of Readiness and Methods of Inspection and Assessment for Beam-forming Cathode Bracket Welding Machines 
  Issued on:   Price(USD): 164.0
SJ/T 31214-1994 Requirements of Readiness and Methods of Inspection and Assessment for Inner/outer Cathode Thimble Assembly Welding Machines 
  Issued on:   Price(USD): 164.0
SJ/T 31272-1994 Requirements of Readiness and Methods of Inspection and Assessment for LM-2 Grinding Machines 
  Issued on:   Price(USD): 164.0
SJ/T 31193-1994 Requirements of Readiness and Methods of Inspection and Assessment for Biaxial Panel Grinding Machines 
  Issued on:   Price(USD): 45.0
SJ/T 31091-1994 Requirements of Readiness and Methods of Inspection and Assessment for Wafer Slicers 
  Issued on:   Price(USD): 115.0
SJ/T 31212-1994 Requirements of Readiness and Methods of Inspection and Assessment for Cathode Sleeve and Ceramic Chip Riveting Machines 
  Issued on:   Price(USD): 45.0
SJ/T 31092-1994 Requirements of Readiness and Methods of Inspection and Assessment for NC Wafer Cutting (Scribing) Machines 
  Issued on:   Price(USD): 115.0
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