Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add to Cart |
GB/T 15876-1995 |
Specification of leadframes for plastic quad flat package |
$224.00 |
via email in 1~3 business day |
abolished2016-01-01,2016-1-1,1996-8-1 |
|
GB/T 15878-1995 |
Specification of leadframes for small outline package |
$224.00 |
via email in 1~3 business day |
abolished2016-01-01,2016-1-1,1996-8-1 |
|
GB/T 15879-1995 |
Mechanical standardization of semiconductor devices Part 5: Recommendation applying to tape automated bonding (TAB) of integrated circuits |
$150.00 |
via email in 1~3 business day |
abolished2019-04-01 ,2019-4-1,1996-8-1 |
|
GB/T 15879.4-2019 |
Mechanical standardization of semiconductor devices—Part 4:Coding system and classification into forms of package outlines for semiconductor device packages |
$250.00 |
via email in 1~3 business day |
valid,,2019-12-1 |
|
GB/T 15879.5-2018 |
Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits |
$550.00 |
via email in 1~5 business day |
valid,,2019-4-1 |
|
GB/T 15879.604-2023 |
Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA) |
$285.00 |
via email in 1~3 business day |
valid,,2023-9-1 |
|
GB/T 16464-1996 |
Semiconductor devices Integrated circuits Part 1: General |
$250.00 |
via email in 1~3 business day |
valid,,1997-1-1 |
|
GB/T 16465-1996 |
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
$370.00 |
via email in 1~3 business day |
valid,,1997-1-1 |
|
GB/T 16466-1996 |
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
$135.00 |
via email in 1~3 business day |
valid,,1997-1-1 |
|
GB/T 16525-1996 |
Specification of leadframes for plastic leaded chip carrier packages |
$100.00 |
via email in 1~3 business day |
superseded,2016-1-1,1997-5-1 |
|
GB/T 16526-1996 |
The method measuring the lead-to-lead and loading capacitance of package leads |
$60.00 |
via email in 1~3 business day |
valid,,1997-5-1 |
|
GB/T 17023-1997 |
Semiconductor devices Integrated circuits - Part 2: Digital integrated circuits Section two - Family specification for HCMOS digital integrated circuits series 54/74HC, 54/74HCT, 54/74 |
$300.00 |
via email in 1~3 business day |
valid,,1998-9-1 |
|
GB/T 17024-1997 |
Semiconductor devices Integrated circuits Part2:Digital integrated circuits Section three—Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU |
$160.00 |
via email in 1~3 business day |
valid,,1998-9-1 |
|
GB/T 17574-1998 |
Semiconductor devices --Integrated circuits Part 2:Digital integrated circuits |
$1620.00 |
via email in 1~3 business day |
valid,,1999-6-1 |
|
GB/T 19248-2003 |
Test method for measuring the resistance of package leads |
$30.00 |
via email in 1~3 business day |
valid,,2003-10-1 |
|
GB/T 20296-2012 |
Mnemonics and symbols for integrated circuits |
$450.00 |
via email in 1~3 business day |
valid,,2013-7-1 |
|
GB/T 26111-2010 |
Micro-electromechanical system technology—Terms |
$570.00 |
via email in 1~3 business day |
superseded,2023-9-1,2011-10-1 |
|
GB/T 26112-2010 |
Micro-electromechanical system technology—General rules for the assessment of micro-mechanical parameters |
$240.00 |
via email in 1~3 business day |
valid,,2011-10-1 |
|
GB/T 26113-2010 |
Micro-electromechanical system technology—General rules for the assessment of micro-geometrical parameters |
$130.00 |
via email in 1~3 business day |
valid,,2011-7-1 |
|
GB/T 28274-2012 |
Silicon-based MEMS fabrication technology—The basic regulation of layout design |
$210.00 |
via email in 1~3 business day |
valid,,2012-12-1 |
|
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