2025-12-8 216.73.216.21
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
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Standard No. Title Price(USD) Delivery Status Add to Cart
GB/T 45720-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for gate dielectric films 375.0 via email in 1~5 business day valid,,2025-9-1
GB/T 45721.1-2025 Semiconductor devices—Stress migration test—Part 1: Copper stress migration test 435.0 via email in 1~5 business day valid,,2025-9-1
GB/T 45722-2025 Semiconductor devices—Constant current electromigration test 270.0 via email in 1~3 business day valid,,2025-9-1
GB/T 45719-2025 Semiconductor devices—Hot carrier test on metal-oxide semiconductor(MOS) transistors 270.0 via email in 1~3 business day valid,,2025-9-1
GB/T 45718-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for inter-metal layers 315.0 via email in 1~5 business day valid,,2025-9-1
GB/T 45716-2025 Semiconductor devices—Bias temperature instability test for metal-oxide semiconductor field-effect transistors (MOSFETs) 270.0 via email in 1~3 business day valid,,2025-9-1
T/CEPEA 0101-2023 X-ray real-time imaging detection method for IGBT module welding quality 420.0 via email in 1~5 business day valid,,2024-3-15
GB/T 20870.4-2024 Semiconductor devices—Part 16-4：Microwave intergrated circuits—Switches 435.0 via email in 1~5 business day valid,,2024-10-26
GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components 330.0 via email in 1~3 business day valid,,2024-7-1
GB/T 4937.34-2024 Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling 210.0 via email in 1~3 business day valid,,2024-7-1
T/SLEIA 0003-2024 via email in business day valid,,2024-2-26
T/CIE 145-2022 Measurement method of radiation induced traps by deep level transient spectroscopy 225.0 via email in 1~3 business day valid,,
GB/T 20870.5-2023 Semiconductor devices—Part 16-5: Microwave integrated circuits—Oscillators 600.0 via email in 1~5 business day valid,,2024-1-1
GB/T 20870.2-2023 Semiconductor devices—Part 16-2: Microwave integrated circuits—Frequency prescalers 435.0 via email in 1~5 business day valid,,2023-9-7
GB/T 4937.26-2023 Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM） 800.0 via email in 1~5 business day valid,,2024-4-1
T/CIE 119-2021 Test method and procedure of atmospheric-neutron induced single event effects in semiconductor devices 225.0 via email in 1~3 business day valid,,
T/CIE 147-2022 Technical specification for evaluation of space TWT accelerated life test 225.0 via email in 1~3 business day valid,,
GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27: Electrostatic discharge(ESD) sensitivity testing—Machine model(MM) 255.0 via email in 1~3 business day valid,,2023-12-1
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life 255.0 via email in 1~3 business day valid,,2023-12-1
GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices（externally induced） 120.0 via email in 1~3 business day valid,,2023-12-1
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GB/T 45720-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for gate dielectric films 
  Issued on: 2025-05-30   Price(USD): 375.0
GB/T 45721.1-2025 Semiconductor devices—Stress migration test—Part 1: Copper stress migration test 
  Issued on: 2025-05-30   Price(USD): 435.0
GB/T 45722-2025 Semiconductor devices—Constant current electromigration test 
  Issued on: 2025-05-30   Price(USD): 270.0
GB/T 45719-2025 Semiconductor devices—Hot carrier test on metal-oxide semiconductor(MOS) transistors 
  Issued on: 2025-05-30   Price(USD): 270.0
GB/T 45718-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for inter-metal layers 
  Issued on: 2025-05-30   Price(USD): 315.0
GB/T 45716-2025 Semiconductor devices—Bias temperature instability test for metal-oxide semiconductor field-effect transistors (MOSFETs) 
  Issued on: 2025-05-30   Price(USD): 270.0
T/CEPEA 0101-2023 X-ray real-time imaging detection method for IGBT module welding quality 
  Issued on: 2024-03-01   Price(USD): 420.0
GB/T 20870.4-2024 Semiconductor devices—Part 16-4：Microwave intergrated circuits—Switches 
  Issued on: 2024-10-26   Price(USD): 435.0
GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components 
  Issued on: 2024-3-15   Price(USD): 330.0
GB/T 4937.34-2024 Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling 
  Issued on: 2024-3-15   Price(USD): 210.0
T/SLEIA 0003-2024  
  Issued on: 2024-01-26   Price(USD):
T/CIE 145-2022 Measurement method of radiation induced traps by deep level transient spectroscopy 
  Issued on: 2022-12-31   Price(USD): 225.0
GB/T 20870.5-2023 Semiconductor devices—Part 16-5: Microwave integrated circuits—Oscillators 
  Issued on: 2023-9-7   Price(USD): 600.0
GB/T 20870.2-2023 Semiconductor devices—Part 16-2: Microwave integrated circuits—Frequency prescalers 
  Issued on: 2023-9-7   Price(USD): 435.0
GB/T 4937.26-2023 Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM） 
  Issued on: 2023-9-7   Price(USD): 800.0
T/CIE 119-2021 Test method and procedure of atmospheric-neutron induced single event effects in semiconductor devices 
  Issued on: 2021-11-22   Price(USD): 225.0
T/CIE 147-2022 Technical specification for evaluation of space TWT accelerated life test 
  Issued on:   Price(USD): 225.0
GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27: Electrostatic discharge(ESD) sensitivity testing—Machine model(MM)  
  Issued on: 2023-05-23   Price(USD): 255.0
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life 
  Issued on: 2023-05-23   Price(USD): 255.0
GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices（externally induced）  
  Issued on: 2023-05-23   Price(USD): 120.0
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