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Chinese Standard Classification
Professional Classification
ICS Classification
Latest
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| Position: Search | valid to be valid superseded to be superseded abolished to be abolished |
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Chinese Standard Classification
Professional Classification
ICS Classification
Latest
|
| Position: Search | valid to be valid superseded to be superseded abolished to be abolished |
|
| Search |
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GB/T 18334-2025 Specification for flexible multilayer printed boards
Issued on: 2025-10-31 Price(USD): 690.0 |
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T/ZSA 243-2024 General technical specification for electronic circuit desktop printing equipment
Issued on: 2024-08-23 Price(USD): |
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GB/T 45723-2025 Test method for printed board—Monitoring of single plated-through hole(PTH) resistance change during temperature cycling
Issued on: 2025-05-30 Price(USD): 210.0 |
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GB/T 45714.54-2025 Printed circuit board materials—Part 5-4:Sectional specification set for conductive foils and films with or without coatings—Conductive pastes
Issued on: 2025-05-30 Price(USD): 375.0 |
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GB/T 45713.4-2025 Electronics assembly technology—Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Issued on: 2025-05-30 Price(USD): 645.0 |
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GB/T 45660-2025 Electronics assembly technology—Electronic modules
Issued on: 2025-05-30 Price(USD): 315.0 |
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GB/T 33772.2-2025 Quality assessment systems —Part 2: Selection and use of sampling plans for inspection of electronic components and packages
Issued on: 2025-05-30 Price(USD): 315.0 |
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GB/T 19405.3-2025 Surface mounting technology—Part 3:Standard method for the specification of components for through hole reflow（THR）soldering
Issued on: 2025-04-25 Price(USD): 375.0 |
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GB/T 44295-2024 Epoxide woven E-glass prepreg for multilayer printed boards
Issued on: 2024-8-23 Price(USD): 435.0 |
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GB/T 43863-2024 Format for LSI—Package—Board interoperable design
Issued on: 2024-4-25 Price(USD): 3225.0 |
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GB/T 43799-2024 Sectional specification for high density interconnect printed boards
Issued on: 2024-3-15 Price(USD): 510.0 |
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GB/T 43801-2024 Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency—Split post dielectric resonator method
Issued on: 2024-3-15 Price(USD): 375.0 |
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GB/T 19247.6-2024 Printed board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Issued on: 2024-3-15 Price(USD): 570.0 |
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GB/T 43059-2023 Requirements of flatness control for printed boards and printed board assemblies
Issued on: 2023-09-07 Price(USD): 160.0 |
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GB/T 4725-2022 Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
Issued on: 2022-03-09 Price(USD): 180.0 |
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GB/T 9491-2021 Flux for tin soldering
Issued on: 2021-12-31 Price(USD): 435.0 |
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GB/T 4721-2021 General rules for rigid copper clad laminates for printed circuits
Issued on: 2021-11-26 Price(USD): 255.0 |
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GB/T 39342-2020 Aerospace electronic products—General specification for printed circuit board
Issued on: 2020-11-19 Price(USD): 375.0 |
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GB/T 14515-2019 Sectional specification for single and double sided flexible printed board
Issued on: 2019-03-25 Price(USD): 630.0 |
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GB/T 5489-2018 Printed circuit board draw
Issued on: 2018-09-17 Price(USD): 250.0 |
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