2025-7-11 18.97.14.87
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
DB37/T 3142-2018 Technical regulation of Phased-array Ultrasonic Testing for welded joints of small diameter pipe via email in business day valid,,2018-3-13
DB37/T 3143-2018 Technical regulation of Phased-array Ultrasonic Testing for socket welded joints of small diameter pipe via email in business day valid,,2018-3-13
DB37/T 3589-2019 Remanufacturing Test sample preparation method for bonding strength of laser cladding layer and substrate via email in business day valid,,2019-6-29
DB37/T 3590-2019 Remanufacturing Test method for bonding strength of laser cladding layer and substrate via email in business day valid,,2019-6-29
DB37/T 4360-2021 The technical code of Phased-array Ultrasonic Testing of welded joints of medium and large diameter pipes 405.0 via email in 1~5 business day valid,,2021-4-11
DB37/T 4361-2021 The technical code of Phased-array Ultrasonic Testing for inspecting bolts 300.0 via email in 1~5 business day valid,,2021-4-11
DL/T 999-2006 The gradational standard of spheroidizition for 2.25Cr-1Mo steel used in power plant 240.0 via email in 1~3 business day valid,,2006-10-1
GB/T 10567.2-2007 Wrought copper and copper alloys—Detection of residual stress—Ammonia test 140.0 via email in 1 business day valid,,2008-4-1
GB/T 11073-2007 Standard method for measuring radial resistivity variation on silicon slices 210.0 via email in 1~3 business day valid,,2008-2-1
GB/T 13925-2010 Metallographs for high manganese cast steel 60.0 via email in 1 business day superseded,2026-1-1,2011-6-1
GB/T 14140.2-1993 Silicon slices and wafers-Measuring of diameter-Micrometer method 184.0 via email in 1~3 business day superseded2010-06-01,2010-6-1,1993-10-1
GB/T 1550-1997 methods for measuring conductivity type of extrinsic semiconducting materials 120.0 via email in 1~3 business day superseded,2019-11-1,1997-1-2
GB/T 1553-1997 Standard test methods for minority carrier lifetime in bulk germanium and silicon by measurement of photoconductivity decay 240.0 via email in 1~3 business day abolished2010-06-01,2010-6-1,1997-1-2
GB/T 15615-1995 Test method for measuring flexture strength of silicon slices 340.0 via email in 1~3 business day abolished2005-10-14 ,,1996-2-1
GB/T 16481-1996 STANDARD spectrum tables of microwave plasma torch-atomic emitting spectrum of rare earth 210.0 via email in 1~3 business day abolished2017-12-15,,1997-1-1
GB/T 17473.1-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of solids content 60.0 via email in 1~3 business day superseded2008-09-01,2008-9-1,1999-3-1
GB/T 17473.2-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of fineness 60.0 via email in 1~3 business day superseded2008-09-01,2008-9-1,1999-3-1
GB/T 17473.3-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of sheet resistance 90.0 via email in 1~3 business day superseded2008-09-01,2008-9-1,1999-3-1
GB/T 17473.4-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of adhesion 75.0 via email in 1~3 business day superseded2008-09-01,2008-9-1,1999-3-1
GB/T 17473.5-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of viscosity 60.0 via email in 1~3 business day superseded2008-09-01,2008-9-1,1999-3-1
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DB37/T 3142-2018 Technical regulation of Phased-array Ultrasonic Testing for welded joints of small diameter pipe 
  Issued on: 2018-02-13   Price(USD):
DB37/T 3143-2018 Technical regulation of Phased-array Ultrasonic Testing for socket welded joints of small diameter pipe 
  Issued on: 2018-02-13   Price(USD):
DB37/T 3589-2019 Remanufacturing Test sample preparation method for bonding strength of laser cladding layer and substrate 
  Issued on: 2019-05-29   Price(USD):
DB37/T 3590-2019 Remanufacturing Test method for bonding strength of laser cladding layer and substrate 
  Issued on: 2019-05-29   Price(USD):
DB37/T 4360-2021 The technical code of Phased-array Ultrasonic Testing of welded joints of medium and large diameter pipes 
  Issued on: 2021-03-11   Price(USD): 405.0
DB37/T 4361-2021 The technical code of Phased-array Ultrasonic Testing for inspecting bolts 
  Issued on: 2021-03-11   Price(USD): 300.0
DL/T 999-2006 The gradational standard of spheroidizition for 2.25Cr-1Mo steel used in power plant 
  Issued on: 2006-5-6   Price(USD): 240.0
GB/T 10567.2-2007 Wrought copper and copper alloys—Detection of residual stress—Ammonia test 
  Issued on: 1989-3-22   Price(USD): 140.0
GB/T 11073-2007 Standard method for measuring radial resistivity variation on silicon slices 
  Issued on: 2007-12-18   Price(USD): 210.0
GB/T 13925-2010 Metallographs for high manganese cast steel 
  Issued on: 2010-12-23   Price(USD): 60.0
GB/T 14140.2-1993 Silicon slices and wafers-Measuring of diameter-Micrometer method 
  Issued on: 1993-02-06   Price(USD): 184.0
GB/T 1550-1997 methods for measuring conductivity type of extrinsic semiconducting materials 
  Issued on: 1997-6-3   Price(USD): 120.0
GB/T 1553-1997 Standard test methods for minority carrier lifetime in bulk germanium and silicon by measurement of photoconductivity decay 
  Issued on: 1997-06-03   Price(USD): 240.0
GB/T 15615-1995 Test method for measuring flexture strength of silicon slices 
  Issued on: 1995-07-12   Price(USD): 340.0
GB/T 16481-1996 STANDARD spectrum tables of microwave plasma torch-atomic emitting spectrum of rare earth 
  Issued on: 1996-7-9   Price(USD): 210.0
GB/T 17473.1-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of solids content 
  Issued on: 1998-08-19   Price(USD): 60.0
GB/T 17473.2-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of fineness 
  Issued on: 1998-08-19   Price(USD): 60.0
GB/T 17473.3-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of sheet resistance 
  Issued on: 1998-08-19   Price(USD): 90.0
GB/T 17473.4-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of adhesion 
  Issued on: 1998-08-19   Price(USD): 75.0
GB/T 17473.5-1998 Test methods of precious metal pastes used for thick film microelectronics--Determination of viscosity 
  Issued on: 1998-08-19   Price(USD): 60.0
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