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Position: Chinese Standard in English/DB31/T 842-2025
DB31/T 842-2025   Specification for occupational hazards control in microelectronic components manufacturing industry (English Version)
Standard No.: DB31/T 842-2025 Status:to be valid remind me the status change

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Target Language:English File Format:PDF
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Standard No.: DB31/T 842-2025
English Name: Specification for occupational hazards control in microelectronic components manufacturing industry
Chinese Name: 微电子元件制造业职业病危害控制规范
Chinese Classification: C60    Diagnostic standard for occupational diseases
Professional Classification: DB    Provincial Standard
Source Content Issued by: Shanghai Municipal Administration for Market Regulation
Issued on: 2025-12-23
Implemented on: 2026-4-1
Status: to be valid
Superseding:DB31/T 842-2014 Guideline for occupational hazards control in microelectroniccomponents manufacturing industry
DB31/ 842-2014
Target Language: English
File Format: PDF
本文件规定了微电子元件制造业用人单位(以下简称“用人单位”)职业卫生管理基本要求、职业病危害因素控制、应急救援措施以及辅助设施的管理要求。
本文件适用于上海市微电子元件制造业集成电路芯片加工、封装与测试用人单位的职业病危害控制活动。
Code of China
Standard
DB31/T 842-2025  Specification for occupational hazards control in microelectronic components manufacturing industry (English Version)
Standard No.DB31/T 842-2025
Statusto be valid
LanguageEnglish
File FormatPDF
Word Count words
Price(USD)
Implemented on2026-4-1
Deliveryvia email in business day
Detail of DB31/T 842-2025
Standard No.
DB31/T 842-2025
English Name
Specification for occupational hazards control in microelectronic components manufacturing industry
Chinese Name
微电子元件制造业职业病危害控制规范
Chinese Classification
C60
Professional Classification
DB
ICS Classification
Issued by
Shanghai Municipal Administration for Market Regulation
Issued on
2025-12-23
Implemented on
2026-4-1
Status
to be valid
Superseded by
Superseded on
Abolished on
Superseding
DB31/T 842-2014 Guideline for occupational hazards control in microelectroniccomponents manufacturing industry
DB31/ 842-2014
Language
English
File Format
PDF
Word Count
words
Price(USD)
Keywords
DB31/T 842-2025, DB31 842-2025, DB31T 842-2025, DB31/T842-2025, DB31/T 842, DB31/T842, DB31842-2025, DB31 842, DB31842, DB31T842-2025, DB31T 842, DB31T842
Introduction of DB31/T 842-2025
本文件规定了微电子元件制造业用人单位(以下简称“用人单位”)职业卫生管理基本要求、职业病危害因素控制、应急救援措施以及辅助设施的管理要求。
本文件适用于上海市微电子元件制造业集成电路芯片加工、封装与测试用人单位的职业病危害控制活动。
Contents of DB31/T 842-2025
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Keywords:
DB31/T 842-2025, DB31 842-2025, DB31T 842-2025, DB31/T842-2025, DB31/T 842, DB31/T842, DB31842-2025, DB31 842, DB31842, DB31T842-2025, DB31T 842, DB31T842