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| DB32/T 4093-2021 Additive manufacturing-Pore defects testing for metal parts-Industrial computed tomography (CT) method (English Version) |
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Detail of DB32/T 4093-2021
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Introduction of DB32/T 4093-2021
本文件规定了用工业计算机层析成像（CT）法，检测增材制造金属制件中孔隙缺陷的一般要求、检测步骤、检测记录与报告。
本文件适用于使用能量范IN为200keV-10MeV的工业CT系统对增材制造金属制件中孔隙缺陷的检测。
Contents of DB32/T 4093-2021