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| Position: Chinese Standard in English/GB 8750-1988 |
| GB 8750-1988 Cold wire for semiconductor lead bonding (English Version) | |||
| Standard No.: | GB 8750-1988 | Status: | superseded |
| Language: | English | File Format: | |
| Word Count: | 2000 words | Price(USD): | 60.00 remind me the price change |
| Implemented on: | 1989-2-1 | Delivery: | via email in 1~3 business day |
| Standard No.: | GB 8750-1988 |
| English Name: | Cold wire for semiconductor lead bonding |
| Chinese Name: | 半导体器件键合用金丝 |
| Chinese Classification: | H68 Precious metals and their alloys |
| Professional Classification: | GB National Standard |
| Implemented on: | 1989-2-1 |
| Status: | superseded |
| Superseded by: | GB/T 8750-1997 Gold wire for semiconductor devices lead bonding |
| Superseded on: | 1998-8-1 |
| Language: | English |
| File Format: | |
| Word Count: | 2000 words |
| Price(USD): | 60.00 |
| Delivery: | via email in 1~3 business day |