This document specifies the structure, classification, basic parameters, working conditions, requirements, test methods, inspection rules, marking, packaging, transport and storage of fully automatic chip loading machines for integrated circuits.
This document applies to fully automatic chip loading machines for integrated circuit packaging.
2 Normative references
The contents of the following documents constitute the essential provisions of this document through the normative references in the text. Among them, note the date of the reference document, only the date of the corresponding version applies to this document; do not note the date of the reference document, its latest version (including all the revision of the list) applies to this document.
GB/T191 Pictorial marking of packaging, storage and transport
GB/T 5226.1-2019 Mechanical electrical safety mechanical electrical equipment Part 1: General technical conditions
GB/T 13306 Signage
GB 50073- 2013 Clean plant design specification
3 Terminology and definitions
The following terms and definitions apply to this document.
3.1
Wafer wafer
A silicon wafer used in the fabrication of integrated circuits.
Note 1:Round in shape.
Note 2: Silicon wafers can be processed into various circuit component structures to make semiconductor products such as ICs and discrete devices with specific electrical functions.
3.2
Scribing film
tape
The film that remains after the protective film has been removed from a wafer after cutting.
Note: It is used to support and hold the chip in place.
3.3
carrier
A key structural component that forms an electrical circuit by means of bonding materials (gold wire, aluminium wire, copper wire, etc.) to electrically connect the internal circuit leads to the external leads of the chip.
Note 1: Includes leadframes, substrates and ceramic plates etc.
4 Product structure, classification, type and basic parameters
4.1 Structure
The product includes a loading mechanism, a handling mechanism, a dispensing mechanism, a soldering mechanism, an ejector mechanism, an image recognition system, an electrical control system and a discharging mechanism.
4.2 Classification
4.2.1 Classification by product
According to the adhesive material, it is divided into silver paste equipment and DAF film equipment.
4.2.2 Classification according to feeding mechanism
Divided into suction feeding, cassette feeding and compound feeding.
4.2.3 Classification according to feeding mechanism
Classified as gripper feeding mechanism and hook and pin feeding mechanism.
4.2.4 Classification according to loading speed
The number of pieces per hour (UPH) is more than 10,000 pieces, which is called high speed equipment, and below 10,000 pieces, which is called low speed equipment.
4.2.5 Classification by wafer size
According to the maximum wafer size that can be handled by the equipment, it can be divided into 8" equipment and 12 equipment.
4.3 Models
The model numbers of fully automatic wafer loaders for integrated circuits are shown in Figure 1.
4.4
Basic parameters
The basic parameters are shown in Table 1.
5 Operating conditions
5.1 Cleanliness
The cleanliness should comply with some of the provisions in Chapter 3 Air Cleanliness Grades in GB 50073- 2013; the cleanliness grade is better than grade 4 (including grade 4).
5.2 Relative humidity
The relative humidity should be kept within the range of 40%~60%.
5.3 Ambient temperature
The ambient temperature should be maintained within the range of 20°C~27C.
5.4 Anti-static requirements
The anti-static requirements are as follows:
a) The resistance value of moving parts (handling mechanism, dispensing mechanism, etc.) should be less than 10Q;
b) Fixed components should have a resistance value of less than 1Q;
c) Electrostatic discharge (ESD) dissipation time: the ion blower or fan should reduce the voltage from 1000V to within 35V within 5s.
5.5 Power supply requirements
The AC supply voltage should be 220(1s 10%) V and the frequency range should be 50 Hz~60 Hz.
5.6 Equipment current requirements
The rated current of the equipment should not be greater than 16 A, and the peak current should not be greater than 32 A.
5.7 Compressed air pressure and flow requirements
The compressed air pressure should be kept within the range of 0.4 MPa to 0.6 MPa, the flow rate should not exceed 100 L/min, and the compressed air should be kept dry.
5.8 Vacuum pressure requirements
The vacuum pressure should be kept within the range of 60 kPa to - 100 kPa.
6 Requirements
6.1 Appearance
The appearance of the equipment should meet the following requirements:
a) The surface of the equipment is free from obvious unevenness, scratches, rust and other defects;
b) The surface of the equipment has been specially treated to avoid particles and dust.
6.2 Lifting mechanism
The lifting mechanism shall meet the following requirements:
a) The jaws of the lifting mechanism shall be positioned with an accuracy of 5μm, the jaws shall not damage the carrier, and the level of the jaws shall be adjustable to ensure that the carrier and the track are fully fitted;
b) The hook and pin transfer mechanism has a positional accuracy of 50 μm, the hook and pin does not damage the carrier and the position of the hook and pin can be adjusted to ensure a smooth transfer of the carrier in the track;
c) Anti-snagging and anti-reverse measures are available.
6.3 Welding mechanism
The welding mechanism shall meet the following requirements:
a) Including welding moving part and welding head, using servo motor or linear motor driven structure. The positioning accuracy of the welding moving part is
The positioning accuracy of the welding moving part is 5μm to ensure smooth movement of the welding head.
b) The welding head is equipped with a height measuring mechanism (error ≤ 10 pμm), a pressure control mechanism (minimum load ≤ 0.5 N, pressure within 1 N error ≤ 0.1 N, pressure above 1 N relative error ≤ 5%) and a corner compensation mechanism (chip corner accuracy of Shi 1°), and a sensor to determine whether the silicon chip is sucked on.
c) Automatic compensation and correction function for chip mounting position.
d) Support for chip mounting with angle.
6.4 Image recognition system
The image recognition system shall consist of camera, light source and image recognition software. The recognition error of wafer position and carrier position shall be ≤ 5pum.
6.5 Wafer table
The wafer table shall meet the following requirements:
a) including X-Y table and wafer expander, the X-Y table positioning error ≤ 5 μm;
b) Wafer table with wafer sweep function and three-point circle drawing function.
6.6 Ejector mechanism
The ejector mechanism shall meet the following requirements:
a) The chip shall be detached from the wafer scribing film. When the chip is detached from the wafer scribing film, the chip shall be detached from the film by the ejector or other ejecting means, and the back side of the chip shall be free from.
Cracking;
b) The ejector pin shall have a parameter setting function for the height of the ejector pin.
6.7 Dispensing mechanism
The dispensing mechanism shall meet the following requirements:
a) Adjustment of the glue dot size;
6.8 Dispensing mechanism
The dispense mechanism shall meet the following requirements:
a) The cassette can be lifted and changed automatically;
b) Alarm function when there is no cassette or when the cassette is full.
6.9 Electrical part
The electrical section shall comply with the following requirements:
a) All electrical equipment modules shall be reliably connected to the equipment casing;
b) Grounding resistance of the equipment casing <102;
c) The electrical control box of the equipment shall have protection functions for overload, leakage and short circuit.
6.10 Software section
6.10.1 Software functions
The software shall include the following functions:
a) Wafer map pick-up function, support SECS/GEM networking protocol;
b) Real-time display of the working process, such as the number of pieces per fraction (UPH), cycle time, etc., and with the following statistical functions:
Statistics on start-up time;
Statistics on the actual running time;
Statistics on the actual number of bonding;
Statistics on the number of failures;
6.11 Safety requirements
6.11.1 General requirements
The general requirements include:
a) The equipment shall comply with the requirements of GB/T 5226.1-2019;
b) The equipment should have emergency switch markings, grounding markings, interface markings, pipeline markings, anti-trap markings for movable parts, and anti-scald markings for tracks with heating functions.
6.11.2 Safety protection
Safety protection requirements shall include:
a) overcurrent protection devices;
b) the equipment has an emergency stop protection button;
c) a fault warning indicator;
7 Test methods
7.1 Appearance
Visual inspection of the appearance of the equipment.
7.2 Lifting mechanism
The test methods for the lifting mechanism include:
a) Using a laser rangefinder to confirm the accuracy of the jaw position of the transfer mechanism;
b) placing the machine in a jammed position and deliberately placing the frame upside down to see if the machine indicates a fault.
7.3 Welding mechanism
8 Inspection rules
8.1 Inspection classification
Product inspection is divided into type inspection and factory inspection.
8.2 Type inspection
One of the following circumstances, the type test should be carried out:
a) when the new product identification;
9 signs, packaging, transport and storage.
9.1 Marking
9.1.1 Product nameplate
Each tablet loading machine should be fixed product nameplate, in accordance with the provisions of GB / T 13306, and marked with the following content:
a) Trademark;
b) Equipment name, model;
c) the name and address of the manufacturer of the equipment;
d) factory number and date;
Foreword 1 Scope 2 Normative references 3 Terminology and definitions 4 Product structure, classification, type and basic parameters 5 Operating conditions 6 Requirements 7 Test methods 8 Inspection rules 9 signs, packaging, transport and storage.
1 Scope
This document specifies the structure, classification, basic parameters, working conditions, requirements, test methods, inspection rules, marking, packaging, transport and storage of fully automatic chip loading machines for integrated circuits.
This document applies to fully automatic chip loading machines for integrated circuit packaging.
2 Normative references
The contents of the following documents constitute the essential provisions of this document through the normative references in the text. Among them, note the date of the reference document, only the date of the corresponding version applies to this document; do not note the date of the reference document, its latest version (including all the revision of the list) applies to this document.
GB/T191 Pictorial marking of packaging, storage and transport
GB/T 5226.1-2019 Mechanical electrical safety mechanical electrical equipment Part 1: General technical conditions
GB/T 13306 Signage
GB 50073- 2013 Clean plant design specification
3 Terminology and definitions
The following terms and definitions apply to this document.
3.1
Wafer wafer
A silicon wafer used in the fabrication of integrated circuits.
Note 1:Round in shape.
Note 2: Silicon wafers can be processed into various circuit component structures to make semiconductor products such as ICs and discrete devices with specific electrical functions.
3.2
Scribing film
tape
The film that remains after the protective film has been removed from a wafer after cutting.
Note: It is used to support and hold the chip in place.
3.3
carrier
A key structural component that forms an electrical circuit by means of bonding materials (gold wire, aluminium wire, copper wire, etc.) to electrically connect the internal circuit leads to the external leads of the chip.
Note 1: Includes leadframes, substrates and ceramic plates etc.
4 Product structure, classification, type and basic parameters
4.1 Structure
The product includes a loading mechanism, a handling mechanism, a dispensing mechanism, a soldering mechanism, an ejector mechanism, an image recognition system, an electrical control system and a discharging mechanism.
4.2 Classification
4.2.1 Classification by product
According to the adhesive material, it is divided into silver paste equipment and DAF film equipment.
4.2.2 Classification according to feeding mechanism
Divided into suction feeding, cassette feeding and compound feeding.
4.2.3 Classification according to feeding mechanism
Classified as gripper feeding mechanism and hook and pin feeding mechanism.
4.2.4 Classification according to loading speed
The number of pieces per hour (UPH) is more than 10,000 pieces, which is called high speed equipment, and below 10,000 pieces, which is called low speed equipment.
4.2.5 Classification by wafer size
According to the maximum wafer size that can be handled by the equipment, it can be divided into 8" equipment and 12 equipment.
4.3 Models
The model numbers of fully automatic wafer loaders for integrated circuits are shown in Figure 1.
4.4
Basic parameters
The basic parameters are shown in Table 1.
5 Operating conditions
5.1 Cleanliness
The cleanliness should comply with some of the provisions in Chapter 3 Air Cleanliness Grades in GB 50073- 2013; the cleanliness grade is better than grade 4 (including grade 4).
5.2 Relative humidity
The relative humidity should be kept within the range of 40%~60%.
5.3 Ambient temperature
The ambient temperature should be maintained within the range of 20°C~27C.
5.4 Anti-static requirements
The anti-static requirements are as follows:
a) The resistance value of moving parts (handling mechanism, dispensing mechanism, etc.) should be less than 10Q;
b) Fixed components should have a resistance value of less than 1Q;
c) Electrostatic discharge (ESD) dissipation time: the ion blower or fan should reduce the voltage from 1000V to within 35V within 5s.
5.5 Power supply requirements
The AC supply voltage should be 220(1s 10%) V and the frequency range should be 50 Hz~60 Hz.
5.6 Equipment current requirements
The rated current of the equipment should not be greater than 16 A, and the peak current should not be greater than 32 A.
5.7 Compressed air pressure and flow requirements
The compressed air pressure should be kept within the range of 0.4 MPa to 0.6 MPa, the flow rate should not exceed 100 L/min, and the compressed air should be kept dry.
5.8 Vacuum pressure requirements
The vacuum pressure should be kept within the range of 60 kPa to - 100 kPa.
6 Requirements
6.1 Appearance
The appearance of the equipment should meet the following requirements:
a) The surface of the equipment is free from obvious unevenness, scratches, rust and other defects;
b) The surface of the equipment has been specially treated to avoid particles and dust.
6.2 Lifting mechanism
The lifting mechanism shall meet the following requirements:
a) The jaws of the lifting mechanism shall be positioned with an accuracy of 5μm, the jaws shall not damage the carrier, and the level of the jaws shall be adjustable to ensure that the carrier and the track are fully fitted;
b) The hook and pin transfer mechanism has a positional accuracy of 50 μm, the hook and pin does not damage the carrier and the position of the hook and pin can be adjusted to ensure a smooth transfer of the carrier in the track;
c) Anti-snagging and anti-reverse measures are available.
6.3 Welding mechanism
The welding mechanism shall meet the following requirements:
a) Including welding moving part and welding head, using servo motor or linear motor driven structure. The positioning accuracy of the welding moving part is
The positioning accuracy of the welding moving part is 5μm to ensure smooth movement of the welding head.
b) The welding head is equipped with a height measuring mechanism (error ≤ 10 pμm), a pressure control mechanism (minimum load ≤ 0.5 N, pressure within 1 N error ≤ 0.1 N, pressure above 1 N relative error ≤ 5%) and a corner compensation mechanism (chip corner accuracy of Shi 1°), and a sensor to determine whether the silicon chip is sucked on.
c) Automatic compensation and correction function for chip mounting position.
d) Support for chip mounting with angle.
6.4 Image recognition system
The image recognition system shall consist of camera, light source and image recognition software. The recognition error of wafer position and carrier position shall be ≤ 5pum.
6.5 Wafer table
The wafer table shall meet the following requirements:
a) including X-Y table and wafer expander, the X-Y table positioning error ≤ 5 μm;
b) Wafer table with wafer sweep function and three-point circle drawing function.
6.6 Ejector mechanism
The ejector mechanism shall meet the following requirements:
a) The chip shall be detached from the wafer scribing film. When the chip is detached from the wafer scribing film, the chip shall be detached from the film by the ejector or other ejecting means, and the back side of the chip shall be free from.
Cracking;
b) The ejector pin shall have a parameter setting function for the height of the ejector pin.
6.7 Dispensing mechanism
The dispensing mechanism shall meet the following requirements:
a) Adjustment of the glue dot size;
6.8 Dispensing mechanism
The dispense mechanism shall meet the following requirements:
a) The cassette can be lifted and changed automatically;
b) Alarm function when there is no cassette or when the cassette is full.
6.9 Electrical part
The electrical section shall comply with the following requirements:
a) All electrical equipment modules shall be reliably connected to the equipment casing;
b) Grounding resistance of the equipment casing <102;
c) The electrical control box of the equipment shall have protection functions for overload, leakage and short circuit.
6.10 Software section
6.10.1 Software functions
The software shall include the following functions:
a) Wafer map pick-up function, support SECS/GEM networking protocol;
b) Real-time display of the working process, such as the number of pieces per fraction (UPH), cycle time, etc., and with the following statistical functions:
Statistics on start-up time;
Statistics on the actual running time;
Statistics on the actual number of bonding;
Statistics on the number of failures;
6.11 Safety requirements
6.11.1 General requirements
The general requirements include:
a) The equipment shall comply with the requirements of GB/T 5226.1-2019;
b) The equipment should have emergency switch markings, grounding markings, interface markings, pipeline markings, anti-trap markings for movable parts, and anti-scald markings for tracks with heating functions.
6.11.2 Safety protection
Safety protection requirements shall include:
a) overcurrent protection devices;
b) the equipment has an emergency stop protection button;
c) a fault warning indicator;
7 Test methods
7.1 Appearance
Visual inspection of the appearance of the equipment.
7.2 Lifting mechanism
The test methods for the lifting mechanism include:
a) Using a laser rangefinder to confirm the accuracy of the jaw position of the transfer mechanism;
b) placing the machine in a jammed position and deliberately placing the frame upside down to see if the machine indicates a fault.
7.3 Welding mechanism
8 Inspection rules
8.1 Inspection classification
Product inspection is divided into type inspection and factory inspection.
8.2 Type inspection
One of the following circumstances, the type test should be carried out:
a) when the new product identification;
9 signs, packaging, transport and storage.
9.1 Marking
9.1.1 Product nameplate
Each tablet loading machine should be fixed product nameplate, in accordance with the provisions of GB / T 13306, and marked with the following content:
a) Trademark;
b) Equipment name, model;
c) the name and address of the manufacturer of the equipment;
d) factory number and date;
Contents of GB/T 41213-2021
Foreword
1 Scope
2 Normative references
3 Terminology and definitions
4 Product structure, classification, type and basic parameters
5 Operating conditions
6 Requirements
7 Test methods
8 Inspection rules
9 signs, packaging, transport and storage.
