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| Position: Chinese Standard in English/GB/T 41852-2022 |
| GB/T 41852-2022 Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures (English Version) | |||
| Standard No.: | GB/T 41852-2022 | Status: | valid remind me the status change |
| Language: | English | File Format: | |
| Word Count: | 7500 words | Price(USD): | 225.0 remind me the price change |
| Implemented on: | 2022-10-12 | Delivery: | via email in 1~3 business day |
| Standard No.: | GB/T 41852-2022 |
| English Name: | Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures |
| Chinese Name: | 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法 |
| Chinese Classification: | L55 Microcircuit in general |
| Professional Classification: | GB National Standard |
| ICS Classification: | 31.080.99 Other semiconductor devices |
| Issued by: | SAMR and SAMR |
| Issued on: | 2022-10-12 |
| Implemented on: | 2022-10-12 |
| Status: | valid |
| Language: | English |
| File Format: | |
| Word Count: | 7500 words |
| Price(USD): | 225.0 |
| Delivery: | via email in 1~3 business day |