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Position: Chinese Standard in English/GB/T 41853-2022
GB/T 41853-2022   Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement (English Version)
Standard No.: GB/T 41853-2022 Status:valid remind me the status change
Language:English File Format:PDF
Word Count: 10500 words Price(USD):315.00 remind me the price change
Implemented on:2022-10-12 Delivery: via email in 1~5 business day
Standard No.: GB/T 41853-2022
English Name: Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement
Chinese Name: 半导体器件 微机电器件 晶圆间键合强度测量
Chinese Classification: L55    Microcircuit in general
Professional Classification: GB    National Standard
ICS Classification: 31.080.99 31.080.99    Other semiconductor devices 31.080.99
Issued by: SAMR; SAC
Issued on: 2022-10-12
Implemented on: 2022-10-12
Status: valid
Language: English
File Format: PDF
Word Count: 10500 words
Price(USD): 315.00
Delivery: via email in 1~5 business day
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