2025-12-13 216.73.216.3
Code of China Chinese Classification Professional Classification ICS Classification Latest News Value-added Services

Position: Chinese Standard in English/GB/T 6620-1995
GB/T 6620-1995   Test method for measuring warp on silicon slices by noncontact scanning (English Version)
Standard No.: GB/T 6620-1995 Status:superseded remind me the status change

Email:

Target Language:English File Format:PDF
Word Count: 3000 words Translation Price(USD):90.0 remind me the price change

Email:

Implemented on:1995-1-2 Delivery: via email in 1~3 business day

→ → →

,2010-6-1,1995-1-2,141A4CBE58CEA1D41422616452513
Standard No.: GB/T 6620-1995
English Name: Test method for measuring warp on silicon slices by noncontact scanning
Chinese Name: 硅片翘曲度非接触式测试方法
Chinese Classification: H21    Metal physical property test method
Professional Classification: GB    National Standard
Source Content Issued by: STSB
Issued on: 1995-04-18
Implemented on: 1995-1-2
Status: superseded
Superseded by:GB/T 6620-2009 Test method for measuring warp on silicon slices by noncontact scanning
Superseded on:2010-6-1
Superseding:GB 6620-1986 Standard method for measuring warp of silicon slices by noncontacting technique
Target Language: English
File Format: PDF
Word Count: 3000 words
Translation Price(USD): 90.0
Delivery: via email in 1~3 business day
本标准规定了硅单晶切割片、研磨片、抛光片翘曲度的非接触式测量方法。本标准适用于测量直径大于50mm,厚度为150~1000μm的圆形硅片的翘曲度。本标准也适用于测量其他半导体圆片的翘曲度。
Code of China
Standard
GB/T 6620-1995  Test method for measuring warp on silicon slices by noncontact scanning (English Version)
Standard No.GB/T 6620-1995
Statussuperseded
LanguageEnglish
File FormatPDF
Word Count3000 words
Price(USD)90.0
Implemented on1995-1-2
Deliveryvia email in 1~3 business day
Detail of GB/T 6620-1995
Standard No.
GB/T 6620-1995
English Name
Test method for measuring warp on silicon slices by noncontact scanning
Chinese Name
硅片翘曲度非接触式测试方法
Chinese Classification
H21
Professional Classification
GB
ICS Classification
Issued by
STSB
Issued on
1995-04-18
Implemented on
1995-1-2
Status
superseded
Superseded by
GB/T 6620-2009 Test method for measuring warp on silicon slices by noncontact scanning
Superseded on
2010-6-1
Abolished on
Superseding
GB 6620-1986 Standard method for measuring warp of silicon slices by noncontacting technique
Language
English
File Format
PDF
Word Count
3000 words
Price(USD)
90.0
Keywords
GB/T 6620-1995, GB 6620-1995, GBT 6620-1995, GB/T6620-1995, GB/T 6620, GB/T6620, GB6620-1995, GB 6620, GB6620, GBT6620-1995, GBT 6620, GBT6620
Introduction of GB/T 6620-1995
本标准规定了硅单晶切割片、研磨片、抛光片翘曲度的非接触式测量方法。本标准适用于测量直径大于50mm,厚度为150~1000μm的圆形硅片的翘曲度。本标准也适用于测量其他半导体圆片的翘曲度。
Contents of GB/T 6620-1995
About Us   |    Contact Us   |    Terms of Service   |    Privacy   |    Cancellation & Refund Policy   |    Payment
Tel: +86-10-8572 5655 | Fax: +86-10-8581 9515 | Email: coc@codeofchina.com | QQ: 672269886
Copyright: Beijing COC Tech Co., Ltd. 2008-2040
 
 
Keywords:
GB/T 6620-1995, GB 6620-1995, GBT 6620-1995, GB/T6620-1995, GB/T 6620, GB/T6620, GB6620-1995, GB 6620, GB6620, GBT6620-1995, GBT 6620, GBT6620