Standard No.:	GB/Z 41275.4-2023
English Name:	Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array（BGA）re-balling
Chinese Name:	航空电子过程管理 含无铅焊料航空航天及国防电子系统 第4部分：球栅阵列植球
Chinese Classification:	V25    Electronic components
Professional Classification:	GB    National Standard
ICS Classification:	49.025.01 49.025.01    Materials for aerospace construction in general 49.025.01
Issued by:	SAMR; SAC
Issued on:	2023-12-28
Implemented on:	2024-7-1
Status:	valid
Language:	English
File Format:	PDF
Word Count:	20500 words
Price(USD):	615.0
Delivery:	via email in 1~3 business day

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array(BGA) re-balling 1 Scope This document, which is a Technical Specification, defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. Note1: IEC TS 62239-1 and EIA-STD-4899 describe the electronic components management program (ECMP). It does not apply to column grid array (CGA) components or chip scale components. This re-balling document addresses two types of configurations. For other configuration types, see Annex A for tailoring. ——Configuration 1 : A BGA package that will be de-balled and then re-balled with tin-lead balls compatible with a tin-lead soldering assembly process. ——Configuration 2: A BGA package that will be de-balled and then re-balled with Pb-free balls compatible with a Pb-free soldering assembly process. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process. This document is intended to be used by de-balling/re-balling providers and customers, typically avionics original equipment manufacturers (OEM); it defines the requirements for re-balling providers who are providing services to the aerospace, defence, high performance and high reliability electronics industry. Requirements for new BGA component part number qualification are also included. This document identifies the need for the creation of new part numbers for re-balled BGA components, covers process and testing requirements for the de-balling/re-balling process and encourages the automated processes due to the ability to control the process. Companies engaged in re-balling are supposed to have the necessary knowledge, experience and tools, and to customize if needed their own methods for defining a de-balling/re-balling process that meets the requirements in this document. Each customer determines the applicability of this document and the need for full replacement of the existing solder balls. Some applications can have unique requirements that exceed the scope of this document and are therefore specified separately. This document is not intended to address all procedures and processes associated with a de-balling/re-balling facility; it is assumed there are management, quality, manufacturing, safety, calibration and training processes/procedures in place as well as all the necessary tools and equipment to accomplish the work. Note 2: For the purposes of this document, if the term “BGA” is used alone, it is stated as “BGA component". Note 3: The replacement, for example, of damaged tin-lead balls by new tin-lead balls or damaged Pb-free balls by new Pb-free balls is not specifically addressed in this document but some parts of the document and the table for tailoring the requirements (see Annex A) can be used for supporting the operations. Although developed for the avionics industry, this process can be applied by other industrial sectors at their discretion. 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61340-5-1 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements IEC TR 61 340-5-2 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide IEC 62090 Product package labels for electronic components using bar code and two-dimensional symbologies IEC 62668 (all parts) Process management for avionics - Counterfeit prevention AEC-Q1 00-010 Solder ball shear test ANSI/ESD S20.20 Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices) ECA/IPC/JEDEC J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1 acoustic microscopy; AM microscopy that employs very high or ultra-high frequency ultrasound Note: Acoustic microscopy is a technical field where the acoustic microscope operates non-destructively and penetrates most solid materials to make visible images of internal features, including defects such as cracks, delaminations and voids; the acoustic microscope is generally called “scanning acoustic microscope (SAM)”. 3.2 approved supplier organization selling or supplying materiel, parts, products or provision of a service, which has been determined capable by a procuring organization to deliver throughout the lifetime of a contract 3.3 ball grid array; BGA surface mount package wherein the balls for terminations are formed in a grid on the bottom of a package Note: There are different varieties of BGA packages and solder ball technologies such as CBGA, PBGA, TBGA packages. 3.4 ceramic ball grid array; CBGA BGA package with a ceramic body 3.5 declaration of conformance document certified by a competent authority that the supplied good or service meets the required specifications Note: Declaration of conformance can also be called certificate of conformance; the competent authority can be the original manufacturer of the supplied good or service. 3.6 coefficient of thermal expansion; CTE degree of expansion of a material divided by the change in temperature Note1: PCB/PWB CTE (x-y) is measured in the direction in the plane of the piece part mounting surface and is used to quantify the stresses in the solder joint arising from the differences in CTE between the piece parts and the PCB/PWB during thermal cycling. CTE (z axis) is measured in the “thickness” direction and is typically used to quantify plated through hole stress Note2: The term “piece part” can be used in lieu of “component”. [SOURCE: GB/Z 41275.22-2023, 3.1.8] 3.7 customer one who pays for the service or the services provided by another 3.8 de-balling process operation that consists in removing the solder balls from a BGA 3.9 humidity indicator card; HIC card on which a moisture-sensitive chemical is applied such that it will make a significant, perceptible change in color (hue), typically from blue (dry) to pink (wet) when the indicated relative humidity is exceeded 3.10 lead-free less than 0.1% by weight of lead (Pb) in accordance with reduction of hazardous substances (RoHS) guidelines [SOURCE: IEC TS 62647-1:2012, 3.8, modified] 3.11 moisture sensitivity level; MSL alphanumeric rating indicating a plastic electronic device’s susceptibility to damage due to absorbed moisture when subjected to reflow soldering as determined by IPC/JEDEC J-STD-020 3.12 original component manufacturer; OCM company specifying and manufacturing the electronic component [SOURCE: IEC TS 62668-1:201 6, 3.1.13] 3.13 part number unambiguous identifier Note: A part number unambiguously identifies for example an electronic component, a design, or an equipment. 3.14 printed circuit board; PCB printed wiring board; PWB substrate using conductive pathways, tracks or signal traces etched from copper sheets laminated, and allowing to connect electrically a set of electronic components to realize a circuit card [SOURCE: GB/T 41275.21, 3.1.10] 3.15 plastic ball grid array; PBGA BGA with a plastic body 3.16 qualification by similarity act of qualifying a product part number based on already available testing results which have been used to deliver the qualification to another product part number whose technical characteristics are considered similar or practically similar Note: Qualification by similarity may apply to a component part number when the component has package and die sizes, construction and materials which are considered to be insignificantly different from an already ”qualified” component part number. 3.17 re-balling process operation that consists in putting back a solder ball in replacement of the previous one on a ball grid array (BGA) package 3.18 re-balling provider company offering de-balling and re-balling service 3.19 RoHS European directive dealing with the restriction of the use of certain hazardous substances Note: The RoHS directive is a European Union directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 3.20 solder ball technology technology employing solder balls or bumps at the component package level to make mechanical and electrical connections between the component package and the PCB/PWB EXAMPLE: Ball grid arrays (BGAs), flip chips and chip scale interconnections. 3.21 tin-lead solder bearing the elements tin and lead, and corresponding to 63 % by weight of tin and 37% by weight of lead unless otherwise specified [SOURCE: GB/T 41275.3-2022, 3.1.6] 3.22 taped ball grid array; TBGA BGA on a tape substrate Note: The tape is generally a polyimide film. 3.23 qualification process for confirming and approving that a product or service meets the needs or requirements of its user Note: For the purposes of this document, the qualification process applies to manufacturing and production operations and processes. It is generally based on objective evidence (for example tests results, process parameters) demonstrating that the product requirements and the quality demands are met.