 |
|
Standard
| HG/T 5051-2025 Hot melt adhesive for low pressure injection molding encapsulation (English Version) |
|
|
|
|
|
|
|
|
Detail of HG/T 5051-2025
| Standard No. |
|
| English Name |
|
| Chinese Name |
|
| Chinese Classification |
|
| Professional Classification |
|
| ICS Classification |
|
| Issued by |
|
| Issued on |
|
| Implemented on |
|
| Status |
|
| Superseded by |
|
| Superseded on |
|
| Abolished on |
|
| Superseding |
|
| Language |
|
| File Format |
| Word Count |
| Price(USD) |
|
| Keywords |
|
Introduction of HG/T 5051-2025
本文件规定了低压注塑封装用热熔胶粘剂的命名和分类，技术要求，检验规则以及包装、标志、运输和贮存的要求，描述了相应的试验方法本文件适用于传感器、连接器、线束、线路板以及其他电子产品包封用的低压注塑封装用聚酰胺热熔胶粘剂
Contents of HG/T 5051-2025
