HG/T 5051-2025 English Version, HG/T 5051-2025 Hot melt adhesive for low pressure injection molding encapsulation (English Version)

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HG/T 5051-2025 Hot melt adhesive for low pressure injection molding encapsulation (English Version)
Standard No.:	HG/T 5051-2025	Status:	valid remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	4500 words	Translation Price(USD):	135.0 remind me the price change Email:
Implemented on:		Delivery:	via email in 1~3 business day

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Standard No.:	HG/T 5051-2025
English Name:	Hot melt adhesive for low pressure injection molding encapsulation
Chinese Name:	低压注塑封装用热熔胶粘剂
Professional Classification:	HG Professional Standard - Chemistry
Issued on:	2025-07-23
Status:	valid
Superseding:	HG/T 5051-2016 Hot melt adhesive for low pressure injection molding encapsulation
Target Language:	English
File Format:	PDF
Word Count:	4500 words
Translation Price(USD):	135.0
Delivery:	via email in 1~3 business day

Standard

HG/T 5051-2025 Hot melt adhesive for low pressure injection molding encapsulation (English Version)
Standard No.	HG/T 5051-2025
Status	valid
Language	English
File Format	PDF
Word Count	4500 words
Price(USD)	135.0
Implemented on
Delivery	via email in 1~3 business day

Detail of HG/T 5051-2025

Standard No.

English Name

Chinese Name

Chinese Classification

Professional Classification

ICS Classification

Issued by

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Status

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Abolished on

Superseding

Language

File Format

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Price(USD)

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Introduction of HG/T 5051-2025

本文件规定了低压注塑封装用热熔胶粘剂的命名和分类，技术要求，检验规则以及包装、标志、运输和贮存的要求，描述了相应的试验方法本文件适用于传感器、连接器、线束、线路板以及其他电子产品包封用的低压注塑封装用聚酰胺热熔胶粘剂

Contents of HG/T 5051-2025

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Keywords:
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