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| Position: Chinese Standard in English/JB/T 5781-2025 |
| JB/T 5781-2025 Heat sinks for power semiconductors devices - Extruded heat sinks (English Version) | |||
| Standard No.: | JB/T 5781-2025 | Status: | valid remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 8500 words | Translation Price(USD): | 255.0 remind me the price change |
| Implemented on: | Delivery: | via email in 1~3 business day | |
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| Standard No.: | JB/T 5781-2025 |
| English Name: | Heat sinks for power semiconductors devices - Extruded heat sinks |
| Chinese Name: | 电力半导体器件用散热器 型材散热器 |
| Professional Classification: | JB Professional Standard - Machinery |
| Source Content Issued by: | MIIT |
| Issued on: | 2025-10-28 |
| Status: | valid |
| Superseding: | JB/T 5781-1991 Sectioned Radiator for Power Semiconductor Devices. Technical Specification JB/T 8175-1999 Outline dimensions of extruded heat sink for power semiconductor devices |
| Target Language: | English |
| File Format: | |
| Word Count: | 8500 words |
| Translation Price(USD): | 255.0 |
| Delivery: | via email in 1~3 business day |