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| Position: Chinese Standard in English/JB/T 6174-2020 |
| JB/T 6174-2020 The aging process specification for the PCB assembly ofinstrument (English Version) | |||
| Standard No.: | JB/T 6174-2020 | Status: | valid remind me the status change |
| Language: | English | File Format: | |
| Word Count: | 5000 words | Price(USD): | 160.0 remind me the price change |
| Implemented on: | 2021-7-1 | Delivery: | via email in 1~3 business day |
| Standard No.: | JB/T 6174-2020 |
| English Name: | The aging process specification for the PCB assembly ofinstrument |
| Chinese Name: | 仪器仪表印制电路板组装件老化工艺规范 |
| Professional Classification: | JB Professional Standard - Machinery |
| Issued by: | MIIT |
| Issued on: | 2020-12-9 |
| Implemented on: | 2021-7-1 |
| Status: | valid |
| Superseding: | JB/T 6174-1992 Process Specification for Aging Process of Instrumentation PCB |
| Language: | English |
| File Format: | |
| Word Count: | 5000 words |
| Price(USD): | 160.0 |
| Delivery: | via email in 1~3 business day |