SJ/T 11030-2015 English Version, SJ/T 11030-2015 Test method for lead, phosphorus, zinc, in gold copper and gold nickel brazing for electron device by ICP-AES (English Version)

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SJ/T 11030-2015 Test method for lead, phosphorus, zinc, in gold copper and gold nickel brazing for electron device by ICP-AES (English Version)
Standard No.:	SJ/T 11030-2015	Status:	valid remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	5000 words	Translation Price(USD):	164.0 remind me the price change Email:
Implemented on:	2016-4-1	Delivery:	via email in 1~3 business day

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Standard No.:	SJ/T 11030-2015
English Name:	Test method for lead, phosphorus, zinc, in gold copper and gold nickel brazing for electron device by ICP-AES
Chinese Name:	电子器件用金铜及金镍钎料中杂质铅、锌、磷的ICP-AES测定方法
Professional Classification:	SJ Professional Standard - Electronics
Source Content Issued by:	Ministry of Industry and Information Technology
Issued on:	2015-10-10
Implemented on:	2016-4-1
Status:	valid
Superseding:	SJ/T 11030-1996 Methods of analysis for gold-copper and gold-nickel brazing for electronic devices-Determination of lead (spectrophotometric dithizone method) SJ/T 11032-1996 Methods of analysis for gold-copper and gold-nickel brazing for electronic devices-Determination of zinc (spectrophotometric atomic absorption method) SJ/T 11031-1996 Methods of analysis for gold-copper and gold-nickel brazing for elelctronic devices - Determination of phophorus (spectrophotometric method)
Target Language:	English
File Format:	PDF
Word Count:	5000 words
Translation Price(USD):	164.0
Delivery:	via email in 1~3 business day

Standard

SJ/T 11030-2015 Test method for lead, phosphorus, zinc, in gold copper and gold nickel brazing for electron device by ICP-AES (English Version)
Standard No.	SJ/T 11030-2015
Status	valid
Language	English
File Format	PDF
Word Count	5000 words
Price(USD)	164.0
Implemented on	2016-4-1
Delivery	via email in 1~3 business day

Detail of SJ/T 11030-2015

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Introduction of SJ/T 11030-2015

本标准规定了用ICP-AES测定铅、磷、锌的测试方法。适用于电子器件用金铜及金镍钎料中铅、锌、磷的测定，

Contents of SJ/T 11030-2015

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