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Position: Chinese Standard in English/T/CIE 116-2021
T/CIE 116-2021   Fault tree analysis method and procedure of electronic components (English Version)
Standard No.: T/CIE 116-2021 Status:valid remind me the status change

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Target Language:English File Format:PDF
Word Count: 12500 words Translation Price(USD):375.0 remind me the price change

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Standard No.: T/CIE 116-2021
English Name: Fault tree analysis method and procedure of electronic components
Chinese Name: 电子元器件故障树分析方法与程序
Chinese Classification: L40    Semiconductor discrete devices in general
Professional Classification: T/    Social Organization Standard
Source Content Issued by: CIE
Issued on: 2021-11-22
Status: valid
Target Language: English
File Format: PDF
Word Count: 12500 words
Translation Price(USD): 375.0
Delivery: via email in 1~5 business day
本文件确立了基于失效物理的电子元器件故障树建树方法及故障树分析程序。描述了以故障树为载体的电子元器件故障信息库构建方法。
本文件适用于电子元器件在设计、研制、生产和使用阶段进行故障树建造和失效路径分析,以及电子元器件在设计和应用阶段的潜在失效问题识别,其结果可用于电子元器件的质量归零问题分析、可靠性设计分析和应用风险分析。
本文件方法适用于半导体分立器件、半导体集成电路、混合集成电路、机电元件、印制电路板等电子元器件。
Code of China
Standard
T/CIE 116-2021  Fault tree analysis method and procedure of electronic components (English Version)
Standard No.T/CIE 116-2021
Statusvalid
LanguageEnglish
File FormatPDF
Word Count12500 words
Price(USD)375.0
Implemented on
Deliveryvia email in 1~5 business day
Detail of T/CIE 116-2021
Standard No.
T/CIE 116-2021
English Name
Fault tree analysis method and procedure of electronic components
Chinese Name
电子元器件故障树分析方法与程序
Chinese Classification
L40
Professional Classification
T/
ICS Classification
Issued by
CIE
Issued on
2021-11-22
Implemented on
Status
valid
Superseded by
Superseded on
Abolished on
Superseding
Language
English
File Format
PDF
Word Count
12500 words
Price(USD)
375.0
Keywords
T/CIE 116-2021, T/CIET 116-2021, TCIET 116-2021, T/CIE116-2021, T/CIE 116, T/CIE116, T/CIET116-2021, T/CIET 116, T/CIET116, TCIET116-2021, TCIET 116, TCIET116
Introduction of T/CIE 116-2021
本文件确立了基于失效物理的电子元器件故障树建树方法及故障树分析程序。描述了以故障树为载体的电子元器件故障信息库构建方法。
本文件适用于电子元器件在设计、研制、生产和使用阶段进行故障树建造和失效路径分析,以及电子元器件在设计和应用阶段的潜在失效问题识别,其结果可用于电子元器件的质量归零问题分析、可靠性设计分析和应用风险分析。
本文件方法适用于半导体分立器件、半导体集成电路、混合集成电路、机电元件、印制电路板等电子元器件。
Contents of T/CIE 116-2021
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Keywords:
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