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| T/CPIA 0052-2023 (English Version) |
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Introduction of T/CPIA 0052-2023
本文件规定了光伏组件接线盒用模块二极管的术语和定义、要求、试验方法、检验规则、包装、标志、运输和贮存。
本文件适用于半导体芯片类型为肖特基的地面晶体硅光伏组件接线盒用模块二极管。由金属氧化物半导体场效应晶体管等芯片封装的光伏模块二极管，可参考本文件部分条款。
Contents of T/CPIA 0052-2023