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Position: Chinese Standard in English/T/ICMTIA CMP0037-2023
T/ICMTIA CMP0037-2023   (English Version)
Standard No.: T/ICMTIA CMP0037-2023 Status:valid remind me the status change

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Standard No.: T/ICMTIA CMP0037-2023
Chinese Name: 集成电路用聚氨酯 类化学机械抛光垫
Professional Classification: T/    Social Organization Standard
Source Content Issued by: ICMTIA
Issued on: 2023-03-01
Implemented on: 2023-4-1
Status: valid
Target Language: English
File Format: PDF
本文件规定了集成电路用聚氨酯类化学机械抛光垫(以下简称“抛光垫”)的分类、技术要求、检验方法、检验规则、标志、包装、运输和贮存的要求。
本文件适用于集成电路制造过程中晶圆化学机械平坦化处理所使用的聚氨酯抛光垫。
Code of China
Standard
T/ICMTIA CMP0037-2023   (English Version)
Standard No.T/ICMTIA CMP0037-2023
Statusvalid
LanguageEnglish
File FormatPDF
Word Count words
Price(USD)
Implemented on2023-4-1
Deliveryvia email in business day
Detail of T/ICMTIA CMP0037-2023
Standard No.
T/ICMTIA CMP0037-2023
English Name
Chinese Name
集成电路用聚氨酯 类化学机械抛光垫
Chinese Classification
Professional Classification
T/
ICS Classification
Issued by
ICMTIA
Issued on
2023-03-01
Implemented on
2023-4-1
Status
valid
Superseded by
Superseded on
Abolished on
Superseding
Language
English
File Format
PDF
Word Count
words
Price(USD)
Keywords
T/ICMTIA CMP0037-2023, T/ICMTIAT CMP0037-2023, TICMTIAT CMP0037-2023, T/ICMTIACMP0037-2023, T/ICMTIA CMP0037, T/ICMTIACMP0037, T/ICMTIATCMP0037-2023, T/ICMTIAT CMP0037, T/ICMTIATCMP0037, TICMTIATCMP0037-2023, TICMTIAT CMP0037, TICMTIATCMP0037
Introduction of T/ICMTIA CMP0037-2023
本文件规定了集成电路用聚氨酯类化学机械抛光垫(以下简称“抛光垫”)的分类、技术要求、检验方法、检验规则、标志、包装、运输和贮存的要求。
本文件适用于集成电路制造过程中晶圆化学机械平坦化处理所使用的聚氨酯抛光垫。
Contents of T/ICMTIA CMP0037-2023
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Keywords:
T/ICMTIA CMP0037-2023, T/ICMTIAT CMP0037-2023, TICMTIAT CMP0037-2023, T/ICMTIACMP0037-2023, T/ICMTIA CMP0037, T/ICMTIACMP0037, T/ICMTIATCMP0037-2023, T/ICMTIAT CMP0037, T/ICMTIATCMP0037, TICMTIATCMP0037-2023, TICMTIAT CMP0037, TICMTIATCMP0037