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| T/QGCML 3114-2024 (English Version) |
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Detail of T/QGCML 3114-2024
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Introduction of T/QGCML 3114-2024
本文件规定了光电子器件金属外壳焊接装置工艺规范的术语和定义、技术要求、试验方法、检验规则、标志、包装、运输和贮存。
本文件适用于光电子器件金属外壳焊接装置。
Contents of T/QGCML 3114-2024