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Standard
| YS/T 1595-2023 Molybdenum copper layered composite material for electronic packaging (English Version) |
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Detail of YS/T 1595-2023
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Introduction of YS/T 1595-2023
本文件规定了电子封装用钼铜层状复合材料的技术要求、试验方法、检验规则、标志、包装、运输、贮存及随行文件和订货单内容。
本文件适用于电子封装用钼铜层状复合板，包含三层复合板与五层复合板。
Contents of YS/T 1595-2023