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| Position: Chinese Standard in English/YS/T 678-2008 |
| YS/T 678-2008 Copper wire for semiconductor lead bonding (English Version) | |||
| Standard No.: | YS/T 678-2008 | Status: | abolished remind me the status change |
| Target Language: | English | File Format: | |
| Word Count: | 7000 words | Translation Price(USD): | 210.0 remind me the price change |
| Implemented on: | 2008-9-1 | Delivery: | via email in 1~3 business day |
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| Standard No.: | YS/T 678-2008 |
| English Name: | Copper wire for semiconductor lead bonding |
| Chinese Name: | 半导体器件键合用铜丝 |
| Chinese Classification: | H61 Light metals and their alloys |
| Professional Classification: | YS Professional Standard - Non-ferrous Metal |
| ICS Classification: | 77.150.10 Aluminium products |
| Source Content Issued by: | NDRC |
| Issued on: | 2008-3-12 |
| Implemented on: | 2008-9-1 |
| Status: | abolished |
| Superseded by: | YS/T 678-2024 Copper bonding wire for semiconductor package |
| Superseded on: | 2025-5-1 |
| Abolished on: | 2025-05-01 |
| Target Language: | English |
| File Format: | |
| Word Count: | 7000 words |
| Translation Price(USD): | 210.0 |
| Delivery: | via email in 1~3 business day |