2025-12-16 216.73.216.89
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
GB/T 43061-2023 Semiconductor integrated circuits—Test methods of PWM controller 1000.0 via email in 1~5 business day valid,,2024-4-1
GB/T 42895-2023 Micro-electromechanical systems(MEMS）technology―Bending strength test method for microstructures of silicon based MEMS 225.0 via email in 1~3 business day valid,,2023-12-1
GB/T 42897-2023 Micro-electromechanical systems(MEMS) technology―Tensile strength test method for nano-scale membranes of silicon based MEMS 225.0 via email in 1~3 business day valid,,2023-12-1
GB/T 42839-2023 Semiconductor integrated circuits—Analog digital (AD) converter 495.0 via email in 1~5 business day valid,,2023-12-1
GB/T 42835-2023 Semiconductor integrated circuits—System on chip(SoC) 255.0 via email in 1~3 business day valid,,2023-12-1
GB/T 42837-2023 Microwave semiconductor integrated circuits—Amplifier 240.0 via email in 1~3 business day valid,,2023-12-1
GB/T 42836-2023 Microwave semiconductor integrated circuits—Frequency mixer 495.0 via email in 1~5 business day valid,,2023-12-1
GB/T 42838-2023 Semiconductor integrated circuits—Measuring method of Holzer circuit 255.0 via email in 1~3 business day valid,,2023-12-1
GB/T 42848-2023 Semiconductor intergrated circuits—Test method of direct digital frequency synthesizer 555.0 via email in 1~5 business day valid,,2023-12-1
GB/T 42744-2023 Microwave circuit—Measuring methods for electrically controlled attenuator 360.0 via email in 1~5 business day valid,,2024-3-1
DB32/T 4491-2023 Technical requirements of elevator light curtain via email in business day valid,,
T/CIE 143-2022 Life evaluation method for key structures of complex component package 255.0 via email in 1~3 business day valid,,
T/CIE 148-2022 Resistive memory cell electrical parameter test sepcification 165.0 via email in 1~3 business day valid,,
GB/T 42403-2023 Lasers and laser-related equipment―Test methods for the spectral characteristics of lasers 375.0 via email in 1~5 business day valid,,2023-10-1
GB/T 42750-2023 Measuring methods of optical radiation safety for wearable devices 255.0 via email in 1~3 business day valid,,2023-12-1
GB/T 42709.7-2023 Semiconductor devices—Micro-electromechanical devices—Part 7: MEMS BAW filter and duplexer for radio frequency control and selection 375.0 via email in 1~5 business day valid,,2023-12-1
GB/T 15879.604-2023 Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA) 285.0 via email in 1~3 business day valid,,2023-9-1
GB/T 42709.5-2023 Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches 495.0 via email in 1~5 business day valid,,2023-9-1
T/CIE 120-2021 225.0 via email in 1~3 business day valid,,
T/CIE 117-2021 165.0 via email in 1~3 business day valid,,
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GB/T 43061-2023 Semiconductor integrated circuits—Test methods of PWM controller  
  Issued on: 2023-09-07   Price(USD): 1000.0
GB/T 42895-2023 Micro-electromechanical systems(MEMS）technology―Bending strength test method for microstructures of silicon based MEMS 
  Issued on: 2023-08-06   Price(USD): 225.0
GB/T 42897-2023 Micro-electromechanical systems(MEMS) technology―Tensile strength test method for nano-scale membranes of silicon based MEMS 
  Issued on: 2023-08-06   Price(USD): 225.0
GB/T 42839-2023 Semiconductor integrated circuits—Analog digital (AD) converter 
  Issued on: 2023-08-06   Price(USD): 495.0
GB/T 42835-2023 Semiconductor integrated circuits—System on chip(SoC) 
  Issued on: 2023-08-06   Price(USD): 255.0
GB/T 42837-2023 Microwave semiconductor integrated circuits—Amplifier 
  Issued on: 2023-08-06   Price(USD): 240.0
GB/T 42836-2023 Microwave semiconductor integrated circuits—Frequency mixer 
  Issued on: 2023-08-06   Price(USD): 495.0
GB/T 42838-2023 Semiconductor integrated circuits—Measuring method of Holzer circuit 
  Issued on: 2023-05-06   Price(USD): 255.0
GB/T 42848-2023 Semiconductor intergrated circuits—Test method of direct digital frequency synthesizer 
  Issued on: 2023-08-06   Price(USD): 555.0
GB/T 42744-2023 Microwave circuit—Measuring methods for electrically controlled attenuator 
  Issued on: 2023-08-06   Price(USD): 360.0
DB32/T 4491-2023 Technical requirements of elevator light curtain 
  Issued on: 2023-05-13   Price(USD):
T/CIE 143-2022 Life evaluation method for key structures of complex component package 
  Issued on:   Price(USD): 255.0
T/CIE 148-2022 Resistive memory cell electrical parameter test sepcification 
  Issued on: 2022-12-31   Price(USD): 165.0
GB/T 42403-2023 Lasers and laser-related equipment―Test methods for the spectral characteristics of lasers 
  Issued on: 2023-03-17   Price(USD): 375.0
GB/T 42750-2023 Measuring methods of optical radiation safety for wearable devices  
  Issued on: 2023-05-23   Price(USD): 255.0
GB/T 42709.7-2023 Semiconductor devices—Micro-electromechanical devices—Part 7: MEMS BAW filter and duplexer for radio frequency control and selection  
  Issued on: 2023-05-23   Price(USD): 375.0
GB/T 15879.604-2023 Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA) 
  Issued on: 2023-05-23   Price(USD): 285.0
GB/T 42709.5-2023 Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches 
  Issued on: 2023-05-23   Price(USD): 495.0
T/CIE 120-2021  
  Issued on: 2021-11-22   Price(USD): 225.0
T/CIE 117-2021  
  Issued on: 2021-11-22   Price(USD): 165.0
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