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Position: Chinese Standard in English/GB/T 42895-2023
GB/T 42895-2023   Micro-electromechanical systems(MEMS)technology―Bending strength test method for microstructures of silicon based MEMS (English Version)
Standard No.: GB/T 42895-2023 Status:valid remind me the status change

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Language:English File Format:PDF
Word Count: 7500 words Price(USD):225.0 remind me the price change

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Implemented on:2023-12-1 Delivery: via email in 1~3 business day
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Standard No.: GB/T 42895-2023
English Name: Micro-electromechanical systems(MEMS)technology―Bending strength test method for microstructures of silicon based MEMS
Chinese Name: 微机电系统(MEMS)技术 硅基MEMS微结构弯曲强度试验方法
Chinese Classification: L59    Micromodule
Professional Classification: GB    National Standard
Issued by: SAMR; SAC
Issued on: 2023-08-06
Implemented on: 2023-12-1
Status: valid
Language: English
File Format: PDF
Word Count: 7500 words
Price(USD): 225.0
Delivery: via email in 1~3 business day
本文件描述了硅基MEMS加工所涉及的微结构弯曲强度原位试验的要求和试验方法。
本文件适用于采用微电子工艺制造的微结构弯曲强度测试。
Code of China
Standard
GB/T 42895-2023  Micro-electromechanical systems(MEMS)technology―Bending strength test method for microstructures of silicon based MEMS (English Version)
Standard No.GB/T 42895-2023
Statusvalid
LanguageEnglish
File FormatPDF
Word Count7500 words
Price(USD)225.0
Implemented on2023-12-1
Deliveryvia email in 1~3 business day
Detail of GB/T 42895-2023
Standard No.
GB/T 42895-2023
English Name
Micro-electromechanical systems(MEMS)technology―Bending strength test method for microstructures of silicon based MEMS
Chinese Name
微机电系统(MEMS)技术 硅基MEMS微结构弯曲强度试验方法
Chinese Classification
L59
Professional Classification
GB
ICS Classification
Issued by
SAMR; SAC
Issued on
2023-08-06
Implemented on
2023-12-1
Status
valid
Superseded by
Superseded on
Abolished on
Superseding
Language
English
File Format
PDF
Word Count
7500 words
Price(USD)
225.0
Keywords
GB/T 42895-2023, GB 42895-2023, GBT 42895-2023, GB/T42895-2023, GB/T 42895, GB/T42895, GB42895-2023, GB 42895, GB42895, GBT42895-2023, GBT 42895, GBT42895
Introduction of GB/T 42895-2023
本文件描述了硅基MEMS加工所涉及的微结构弯曲强度原位试验的要求和试验方法。
本文件适用于采用微电子工艺制造的微结构弯曲强度测试。
Contents of GB/T 42895-2023
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Keywords:
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