Standard No. |
Title |
Price(USD) |
Delivery |
Status |
Add to Cart |
GB/T 15876-1995 |
Specification of leadframes for plastic quad flat package |
$224.00 |
via email in 1~3 business day |
abolished2016-01-01,2016-1-1,1996-8-1 |
|
GB/T 15876-2015 |
Semiconductor integrated circuits―Specification of leadframes for plastic quad flat package |
$250.00 |
via email in 1~3 business day |
valid,,2016-1-1 |
|
GB/T 15877-2013 |
Semiconductor integrated circuits—Specification of DIP leadframes produced by etching |
$200.00 |
via email in 1~3 business day |
valid,,2014-8-15 |
|
GB/T 15878-1995 |
Specification of leadframes for small outline package |
$224.00 |
via email in 1~3 business day |
abolished2016-01-01,2016-1-1,1996-8-1 |
|
GB/T 15878-2015 |
Semiconductor integrated circuits―Specification of leadframes for small outline package |
$220.00 |
via email in 1~3 business day |
valid,,2016-1-1 |
|
GB/T 15879-1995 |
Mechanical standardization of semiconductor devices Part 5: Recommendation applying to tape automated bonding (TAB) of integrated circuits |
$150.00 |
via email in 1~3 business day |
abolished2019-04-01 ,2019-4-1,1996-8-1 |
|
GB/T 15879.5-2018 |
Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits |
$550.00 |
via email in 1~5 business day |
valid,,2019-4-1 |
|
GB/T 15879.604-2023 |
Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA) |
$285.00 |
via email in 1~3 business day |
valid,,2023-9-1 |
|
GB/T 16464-1996 |
Semiconductor devices Integrated circuits Part 1: General |
$250.00 |
via email in 1~3 business day |
valid,,1997-1-1 |
|
GB/T 16465-1996 |
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
$370.00 |
via email in 1~3 business day |
valid,,1997-1-1 |
|
GB/T 16466-1996 |
Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
$135.00 |
via email in 1~3 business day |
valid,,1997-1-1 |
|
GB/T 16514.2-2005 |
Electromechanical switches for use iin electronic equipment Part 5LSecitional specification for pushbutton switches Section 1:Blank detail specification |
$180.00 |
via email in 1~3 business day |
valid,,2006-4-1 |
|
GB/T 16523-1996 |
Specification for round quartz photomask substrates |
$130.00 |
via email in 1~3 business day |
valid,,1997-5-1 |
|
GB/T 16524-1996 |
Specification for registration marks for photomasks |
$104.00 |
via email in 1~3 business day |
valid,,1997-5-1 |
|
GB/T 16525-1996 |
Specification of leadframes for plastic leaded chip carrier packages |
$100.00 |
via email in 1~3 business day |
superseded,2016-1-1,1997-5-1 |
|
GB/T 16525-2015 |
Semiconductor integrated circuits―Specification of leadframes for plastic leaded chip carrier package |
$250.00 |
via email in 1~3 business day |
valid,,2016-1-1 |
|
GB/T 16526-1996 |
The method measuring the lead-to-lead and loading capacitance of package leads |
$60.00 |
via email in 1~3 business day |
valid,,1997-5-1 |
|
GB/T 16527-1996 |
Specification for photoresist/E-beam resist for hard surface photoplates |
$100.00 |
via email in 1~3 business day |
valid,,1997-5-1 |
|
GB/T 16530-1996 |
Measuring method for polarization dependence of return loss of a single-mode fibre optic component |
$120.00 |
via email in 1~3 business day |
valid,,1997-5-1 |
|
GB/T 16601.1-2017 |
Lasers and laser-related equipment―Test methods for laser-induced damage threshold―Part 1:Definitions and general principles |
$255.00 |
via email in 1~3 business day |
valid,,2018-7-1 |
|
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* Related standard quantity: * Page quantity: *
Current: * First
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