2026-3-29 216.73.216.113
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
T/TMAC 129-2025 via email in business day valid,,2025-3-3
GB/T 44849-2024 Micro-electromechanical systems (MEMS) technology—Forming limit measuring method of metallic film materials 375.0 via email in 1~5 business day valid,,2025-5-1
GB/T 44839-2024 Micro-electromechanical systems (MEMS) technology一Micro-pillar compression test for MEMS materials 270.0 via email in 1~3 business day valid,,2025-2-1
GB/T 44842-2024 Micro-electromechanical systems （MEMS） technology—Bend testing methods of thin film materials 270.0 via email in 1~3 business day valid,,2024-10-26
GB/T 44529-2024 Micro-electromechanical systems（MEMS）technology—Radio frequency MEMS circulators and isolators 510.0 via email in 1~5 business day valid,,2024-9-29
GB/T 44517-2024 Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films 270.0 via email in 1~3 business day valid,,2025-4-1
GB/T 44513-2024 Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application 315.0 via email in 1~5 business day valid,,2025-1-1
GB/T 44515-2024 Micro-electromechanical systems (MEMS) technology—Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film 315.0 via email in 1~5 business day valid,,2025-1-1
GB/T 44514-2024 Micro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials 270.0 via email in 1~3 business day valid,,2024-9-29
GB/T 42896-2023 Micro-electromechanical systems(MEMS) technology―Impact test method for nanostructures of silicon based MEMS 225.0 via email in 1~3 business day valid,,2023-12-1
GB/T 42158-2023 Micro-electromechanical systems technology(MEMS)―Description and measurement methods for micro trench and pyramidal needle structures 375.0 via email in 1~5 business day valid,,2023-7-1
GB/T 42895-2023 Micro-electromechanical systems(MEMS）technology―Bending strength test method for microstructures of silicon based MEMS 225.0 via email in 1~3 business day valid,,2023-12-1
GB/T 42897-2023 Micro-electromechanical systems(MEMS) technology―Tensile strength test method for nano-scale membranes of silicon based MEMS 225.0 via email in 1~3 business day valid,,2023-12-1
GB/T 26111-2023 Micro-electromechanical system technology—Terms 585.0 via email in 1~5 business day valid,,2023-9-1
GB/T 42597-2023 Micro-electromechanical systems technology—Gyroscopes 675.0 via email in 1~5 business day valid,,2023-9-1
GB/T 42191-2023 Test methods of the performances for MEMS piezoresistive pressure-sensitive device 255.0 via email in 1~3 business day valid,,2023-9-1
SJ 50033/124-1997 Semiconductor discrete device - Detail specification for silicon power PIN diodes for Type PIN101~105 120.0 via email in 1~3 business day valid,,1997-10-1
SJ 20634-1997 Test methods for electronic pastes performance 480.0 via email in 1~3 business day valid,,1997-10-1
SJ 20866-2003 Specification for cross-pressing molybdenum-rhenium alloy pieces 100.0 via email in 1~3 business day valid,,2004-3-1
SJ 50033/109-1996 Semiconductor optoelectronic devices - Detail specification for Types GJ903T and GJ9032T and GJ9034T semiconductor laser diodes 180.0 via email in 1~3 business day valid,,1997-1-1
Previous Page     Next Page



Code of China
Search

T/TMAC 129-2025  
  Issued on: 2025-03-03   Price(USD):
GB/T 44849-2024 Micro-electromechanical systems (MEMS) technology—Forming limit measuring method of metallic film materials 
  Issued on: 2024-10-26   Price(USD): 375.0
GB/T 44839-2024 Micro-electromechanical systems (MEMS) technology一Micro-pillar compression test for MEMS materials 
  Issued on: 2024-10-26   Price(USD): 270.0
GB/T 44842-2024 Micro-electromechanical systems （MEMS） technology—Bend testing methods of thin film materials 
  Issued on: 2024-10-26   Price(USD): 270.0
GB/T 44529-2024 Micro-electromechanical systems（MEMS）technology—Radio frequency MEMS circulators and isolators 
  Issued on: 2024-09-29   Price(USD): 510.0
GB/T 44517-2024 Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films 
  Issued on: 2024-09-29   Price(USD): 270.0
GB/T 44513-2024 Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application 
  Issued on: 2024-09-29   Price(USD): 315.0
GB/T 44515-2024 Micro-electromechanical systems (MEMS) technology—Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film 
  Issued on: 2024-09-29   Price(USD): 315.0
GB/T 44514-2024 Micro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials 
  Issued on: 2024-09-29   Price(USD): 270.0
GB/T 42896-2023 Micro-electromechanical systems(MEMS) technology―Impact test method for nanostructures of silicon based MEMS 
  Issued on: 2023-08-06   Price(USD): 225.0
GB/T 42158-2023 Micro-electromechanical systems technology(MEMS)―Description and measurement methods for micro trench and pyramidal needle structures 
  Issued on: 2023-03-17   Price(USD): 375.0
GB/T 42895-2023 Micro-electromechanical systems(MEMS）technology―Bending strength test method for microstructures of silicon based MEMS 
  Issued on: 2023-08-06   Price(USD): 225.0
GB/T 42897-2023 Micro-electromechanical systems(MEMS) technology―Tensile strength test method for nano-scale membranes of silicon based MEMS 
  Issued on: 2023-08-06   Price(USD): 225.0
GB/T 26111-2023 Micro-electromechanical system technology—Terms  
  Issued on: 2023-05-23   Price(USD): 585.0
GB/T 42597-2023 Micro-electromechanical systems technology—Gyroscopes 
  Issued on: 2023-05-23   Price(USD): 675.0
GB/T 42191-2023 Test methods of the performances for MEMS piezoresistive pressure-sensitive device  
  Issued on: 2023-05-23   Price(USD): 255.0
SJ 50033/124-1997 Semiconductor discrete device - Detail specification for silicon power PIN diodes for Type PIN101~105 
  Issued on: 1997-6-17   Price(USD): 120.0
SJ 20634-1997 Test methods for electronic pastes performance 
  Issued on: 1997-06-17   Price(USD): 480.0
SJ 20866-2003 Specification for cross-pressing molybdenum-rhenium alloy pieces 
  Issued on: 2003-12-25   Price(USD): 100.0
SJ 50033/109-1996 Semiconductor optoelectronic devices - Detail specification for Types GJ903T and GJ9032T and GJ9034T semiconductor laser diodes 
  Issued on: 1996-8-30   Price(USD): 180.0
About Us   |    Contact Us   |    Terms of Service   |    Privacy   |    Cancellation & Refund Policy   |    Payment
Contact us via WeChat
Tel: +86-10-8572 5655 | Fax: +86-10-8581 9515 | Email: coc@codeofchina.com | QQ: 3680948734
Copyright: Beijing COC Tech Co., Ltd. 2008-2040