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| GB/T 15615-1995 Test method for measuring flexture strength of silicon slices (English Version) |
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Detail of GB/T 15615-1995
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Introduction of GB/T 15615-1995
本标准规定了硅单晶切割片、研磨片和抛光片的抗弯强度测试方法。本标准适用于晶向为〈111〉和〈100〉的直拉、悬浮区熔硅单晶片的常温下抗弯强度的测量。硅片厚度为250～900μm。
Contents of GB/T 15615-1995