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| Position: Chinese Standard in English/GB/T 17473.7-1998 |
| GB/T 17473.7-1998 Test methods of precious metal pastes used for thick film microelectronics--Test of solderability and solderleaching resistance (English Version) | |||
| Standard No.: | GB/T 17473.7-1998 | Status: | abolished remind me the status change |
| Language: | English | File Format: | |
| Word Count: | 2500 words | Price(USD): | 75.0 remind me the price change |
| Implemented on: | 1999-3-1 | Delivery: | via email in 1~3 business day |
| Standard No.: | GB/T 17473.7-1998 |
| English Name: | Test methods of precious metal pastes used for thick film microelectronics--Test of solderability and solderleaching resistance |
| Chinese Name: | 厚膜微电子技术用贵金属浆料测试方法 可焊性、耐焊性试验 |
| Chinese Classification: | H23 Metal processing property test method |
| Professional Classification: | GB National Standard |
| ICS Classification: | 77.040.01 Testing of metals in general |
| Issued by: | State Qualtiy Technical Supervision Bureau |
| Issued on: | 1998-08-19 |
| Implemented on: | 1999-3-1 |
| Status: | abolished |
| Superseded by: | GB/T 17473.7-2008 Test methods of precious metals pastes used for microelectronics - Determination of solderability and solderelaching resistance |
| Superseded on: | 2008-9-1 |
| Abolished on: | 2008-09-01 |
| Language: | English |
| File Format: | |
| Word Count: | 2500 words |
| Price(USD): | 75.0 |
| Delivery: | via email in 1~3 business day |