GB/T 4937.2-2006 English Version, GB/T 4937.2-2006 Semiconductor devices - Mechanical and climatic test methods - Part 2 : Low air pressure (English Version)

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GB/T 4937.2-2006 Semiconductor devices - Mechanical and climatic test methods - Part 2 : Low air pressure (English Version)
Standard No.:	GB/T 4937.2-2006	Status:	superseded remind me the status change Email:
Target Language:	English	File Format:	PDF
Word Count:	2500 words	Translation Price(USD):	75.0 remind me the price change Email:
Implemented on:	2007-2-1	Delivery:	via email in 1~3 business day

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Standard No.:	GB/T 4937.2-2006
English Name:	Semiconductor devices - Mechanical and climatic test methods - Part 2 : Low air pressure
Chinese Name:	半导体器件机械和气候试验方法第2部分:低气压
Chinese Classification:	L40 Semiconductor discrete devices in general
Professional Classification:	GB National Standard
Source Content Issued by:	SAC AQSIQ
Issued on:	2006-8-23
Implemented on:	2007-2-1
Status:	superseded
Superseded by:	GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices
Superseded on:	1996-8-1
Superseding:	GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices
Target Language:	English
File Format:	PDF
Word Count:	2500 words
Translation Price(USD):	75.0
Delivery:	via email in 1~3 business day

Standard

GB/T 4937.2-2006 Semiconductor devices - Mechanical and climatic test methods - Part 2 : Low air pressure (English Version)
Standard No.	GB/T 4937.2-2006
Status	superseded
Language	English
File Format	PDF
Word Count	2500 words
Price(USD)	75.0
Implemented on	2007-2-1
Delivery	via email in 1~3 business day

Detail of GB/T 4937.2-2006

Standard No.

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Introduction of GB/T 4937.2-2006

本部分适用于半导体器件的低气压试验。本项试验的目的是测定器件和材料避免电击穿失效的能力，而这种失效是由于气压减小时，空气和其他绝缘材料的绝缘强度减弱所造成的。本项试验仅适用于工作电压超过1000V的器件。本项试验适用于所有的空封半导体器件。本试验仅适用于军事和空间领域。本项低气压试验方法和IEC60068-2-13大体上一致，但鉴于半导体器件的特殊要求，使用本标准条款。

Contents of GB/T 4937.2-2006

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Keywords:
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