Codeofchina.com is in charge of this English translation. In case of any doubt about the English translation, the Chinese original shall be considered authoritative.
This standard is drafted in accordance with the rules given in GB/T 1.1-2009.
This standard replaces GB/T 5230-1995 Electrodeposited copper foil. The following main technical changes have been made with respect to GB/T 5230-1995:
——Terms and definitions such as "elongation", "foil profile", "smooth side", and "matte side" are added (see Clause 3).
——The models are added in the quantity from 2 to 5 (see 4.1; Table 1 of the 1995 edition).
——Designation and labeling of copper foil are added (see 4.2 and 4.3).
——As for the deviation of length and width of copper foil sheets, the provision text "agreed by the supplier and the purchaser" is revised to "as specified in the procurement documents, with the allowable deviation of mm for the length and mm for the width or as agreed by the supplier and the purchaser" (see 5.2.1; 5.2.2.2 of the 1995 edition).
——The width deviation of copper foil roll is modified from 4 width ranges to "as specified in the procurement documents, and the allowable deviation of the width shall be mm or as agreed by the supplier and the purchaser" (see 5.2.2; Table 3 of the 1995 edition).
——The specifications of mass per unit area and thickness are added in quantity from 11 to 16, and the allowable deviation of mass per unit area includes "high precision" level (see Table 3; Table 2 of the 1995 edition).
——The requirements on profile type and profile of copper foils are added (see Table 4).
——The requirements on surface roughness of copper foils are modified (see 5.2.6; 5.7.3 of the 1995 edition).
——The requirements on physical properties of copper foils are modified (see Table 5; 5.3 of the 1995 edition).
· E-01 copper foil: the tensile strength and elongation indexes for the copper foils with a thickness of 9μm and 12μm are added; compared with the former standard, the tensile strength and elongation indexes the copper foils with a thickness of 18μm, 35μm and 70μm are raised; the specific properties indexes the copper foils with a thickness of 25μm are deleted and amended to "agreed by the supplier and the purchaser".
· E-02 copper foil: the tensile strength and elongation indexes for the copper foils with a thickness of 12μm are added; compared to the former standard, the tensile strength indexes for the copper foils with a thickness of 18μm, 35μm and 70μm foil are raised.
· The tensile strength and elongation indexes for E-03, E-04 and E-05 copper foils are added, and the fatigue ductility index for E-05 foil is added.
——The requirements on "etchability," "chemical cleanability," "treatment transfer", "high temperature oxidation resistance" and "purity" are added(see 5.4.1, 5.4.2, 5.4.4, 5.4.5, 5.5).
——The requirement on mass resistivity for the copper foils with a thickness of 15μm is added (see Table 6).
——The modification is made to Clause 7 (Inspection rules): the inspection classification, test conditions, appraisal inspection and quality conformance inspection items, sampling and judgement are added (see Clause 7).
——Annex A (Informative) "Comparison of electrodeposited copper foil models between this standard and foreign standards" is added (see Annex A).
——Annex B (Normative) "Test methods for diameter and quantity of copper powder" is added (see Annex B).
——Annex C (Normative) "Measurement method of warpage of copper foil" is added (see Annex C).
——The seven annexes of GB/T 5230-1995 are deleted (see Annexes A, B, C, D, E, F and G of the 1995 edition).
This standard was proposed by China Nonferrous Metals Industry Association.
This standard is under the jurisdiction of SAC/TC 243 National Technical Committee on Nonferrous Metals of Standardization Administration of China.
The previous editions of the standard are as follows:
——GB/T 5230-1985 and GB/T 5230-1995.
Electrodeposited copper foil for printed board
1 Scope
This standard specifies the classification, designation and labeling, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage, as well as quality certificates and order form (or contract) content of electrodeposited copper foils for printed board.
This standard is applicable to electrodeposited copper foils for printed board (hereinafter referred to as "copper foil").
2 Normative references
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced documents (including any amendments) applies.
GB/T 2036 Terms for printed circuits
GB/T 8888 Wrough heavy non-ferrous metal products - Packing, marking, transportation, storing and certificate of quality
GB/T 29847-2013 Test methods for copper foil used for printed boards
3 Terms and definitions
For the purposes of this standard, the terms and definitions given in GB/T 2036 and the following apply.
3.1
elongation
ratio (expressed by percent) of the distance increment between the effective part markers of the specimen to that between the initial markers when the specimen breaks under tensile load
[GB/T 31471-2015, Definition 3.1]
3.2
foil profile
unevenness of a copper foil surface caused by processing and/or enhanced bonding treatment
[GB/T 31471-2015, Definition 3.4]
3.3
arithmetical mean deviation of the profile
Ra
arithmetic mean of the absolute distances from the center line to the rough profile within the measured length
[GB/T 31471-2015, Definition 3.5]
3.4
ten point height of irregularities
Rz
sum of the 5 largest profile peak height averages and the 5 largest profile valley depth averages within the sampled length
3.5
smooth side
cathode surface, i.e. the side of an electrodeposited copper foil close to the cathode roll
[GB/T 31471-2015, Definition 3.7]
3.6
matte side
the other side corresponding to the smooth side of an electrodeposited copper foil
[GB/T 31471-2015, Definition 3.8]
3.7
treatment transfer
enhancing binder transferred from the copper foil roughening treatment surface to the laminate substrate
3.8
carrier
support medium used to make thin or soft copper foils easy to process and use
3.9
copper foil with releasable carrier
copper foil produced by electrodeposition method using a carrier as a cathode
Note: copper foils with releasable carrier are mainly classified into etchable ones and detachable ones.
3.10
pinhole
light-transmitting micro holes through a copper foil
3.11
penetrating point
opaque pores
3.12
warpage
degree of bending of a copper foil specimen relative to the horizontal surface, characterized by the maximum vertical distance (mm) between the warped surface and the horizontal surface
4 Classification, designation and labeling
4.1 Classification
Copper foils are classified into 5 types by their characteristics, and their models and characteristics are shown in Table 1.
Table 1 Models and characteristics of copper foils
Model Characteristic
E-01 Standard electrodeposited copper foil
E-02 High-elongation electrodeposited copper foil
E-03 High-temperature-elongation electrodeposited copper foil
E-04 Annealable electrodeposited copper foil
E-05 Low-temperature-annealable electrodeposited copper foil
Note: the comparison table of electrodeposited copper foil models between this standard and foreign standards is detailed in Annex A.
4.2 Designation
4.2.1 Types of enhancing bonding treatment for copper foils
The types of enhancing bonding treatments for copper foils may include:
a) non-enhancing bonding treatment without anti-oxidation treatment, denoted by N;
b) non-enhancing bonding treatment with dual-side anti-oxidation treatment, denoted by P;
c) enhancing bonding treatment of matte side (anodic side) with dual-side anti-oxidation treatment, denoted by A;
d) enhancing bonding treatment of both sides with dual-side anti-oxidation treatment, denoted by D;
e) enhancing bonding treatment of smooth side (cathode side) with dual-side anti-oxidation treatment, denoted by R.
Foreword i
1 Scope
2 Normative references
3 Terms and definitions
4 Classification, designation and labeling
4.1 Classification
4.2 Designation
4.3 Labeling
5 Technical requirements
5.1 Appearance quality
5.2 Dimensions and their allowable deviations
5.3 Physical properties
5.4 Processing property
5.5 Purity
5.6 Mass resistivity
6 Test methods
6.1 Appearance quality
6.2 Dimensions and their allowable deviations
6.3 Physical properties
6.4 Processing properties
6.5 Purity
6.6 Mass resistivity
7 Inspection rules
7.1 Inspection and acceptance
7.2 Inspection classification
7.3 Test conditions
7.4 Appraisal inspection (type inspection)
7.5 Quality conformance inspection
8 Marking, packaging, transportation, storage and quality certificate
8.1 Marking
8.2 Packaging
8.3 Transportation, storage and quality certificate
9 Order form (or contract) contents
Annex A (Informative) Comparison of electrodeposited copper foil models between this standard and foreign standards
Annex B (Normative) Test methods for diameter and quantity of copper powder
Annex C (Normative) Measurement method of warpage of copper foil
Bibliography
Codeofchina.com is in charge of this English translation. In case of any doubt about the English translation, the Chinese original shall be considered authoritative.
This standard is drafted in accordance with the rules given in GB/T 1.1-2009.
This standard replaces GB/T 5230-1995 Electrodeposited copper foil. The following main technical changes have been made with respect to GB/T 5230-1995:
——Terms and definitions such as "elongation", "foil profile", "smooth side", and "matte side" are added (see Clause 3).
——The models are added in the quantity from 2 to 5 (see 4.1; Table 1 of the 1995 edition).
——Designation and labeling of copper foil are added (see 4.2 and 4.3).
——As for the deviation of length and width of copper foil sheets, the provision text "agreed by the supplier and the purchaser" is revised to "as specified in the procurement documents, with the allowable deviation of mm for the length and mm for the width or as agreed by the supplier and the purchaser" (see 5.2.1; 5.2.2.2 of the 1995 edition).
——The width deviation of copper foil roll is modified from 4 width ranges to "as specified in the procurement documents, and the allowable deviation of the width shall be mm or as agreed by the supplier and the purchaser" (see 5.2.2; Table 3 of the 1995 edition).
——The specifications of mass per unit area and thickness are added in quantity from 11 to 16, and the allowable deviation of mass per unit area includes "high precision" level (see Table 3; Table 2 of the 1995 edition).
——The requirements on profile type and profile of copper foils are added (see Table 4).
——The requirements on surface roughness of copper foils are modified (see 5.2.6; 5.7.3 of the 1995 edition).
——The requirements on physical properties of copper foils are modified (see Table 5; 5.3 of the 1995 edition).
· E-01 copper foil: the tensile strength and elongation indexes for the copper foils with a thickness of 9μm and 12μm are added; compared with the former standard, the tensile strength and elongation indexes the copper foils with a thickness of 18μm, 35μm and 70μm are raised; the specific properties indexes the copper foils with a thickness of 25μm are deleted and amended to "agreed by the supplier and the purchaser".
· E-02 copper foil: the tensile strength and elongation indexes for the copper foils with a thickness of 12μm are added; compared to the former standard, the tensile strength indexes for the copper foils with a thickness of 18μm, 35μm and 70μm foil are raised.
· The tensile strength and elongation indexes for E-03, E-04 and E-05 copper foils are added, and the fatigue ductility index for E-05 foil is added.
——The requirements on "etchability," "chemical cleanability," "treatment transfer", "high temperature oxidation resistance" and "purity" are added(see 5.4.1, 5.4.2, 5.4.4, 5.4.5, 5.5).
——The requirement on mass resistivity for the copper foils with a thickness of 15μm is added (see Table 6).
——The modification is made to Clause 7 (Inspection rules): the inspection classification, test conditions, appraisal inspection and quality conformance inspection items, sampling and judgement are added (see Clause 7).
——Annex A (Informative) "Comparison of electrodeposited copper foil models between this standard and foreign standards" is added (see Annex A).
——Annex B (Normative) "Test methods for diameter and quantity of copper powder" is added (see Annex B).
——Annex C (Normative) "Measurement method of warpage of copper foil" is added (see Annex C).
——The seven annexes of GB/T 5230-1995 are deleted (see Annexes A, B, C, D, E, F and G of the 1995 edition).
This standard was proposed by China Nonferrous Metals Industry Association.
This standard is under the jurisdiction of SAC/TC 243 National Technical Committee on Nonferrous Metals of Standardization Administration of China.
The previous editions of the standard are as follows:
——GB/T 5230-1985 and GB/T 5230-1995.
Electrodeposited copper foil for printed board
1 Scope
This standard specifies the classification, designation and labeling, technical requirements, test methods, inspection rules, marking, packaging, transportation and storage, as well as quality certificates and order form (or contract) content of electrodeposited copper foils for printed board.
This standard is applicable to electrodeposited copper foils for printed board (hereinafter referred to as "copper foil").
2 Normative references
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced documents (including any amendments) applies.
GB/T 2036 Terms for printed circuits
GB/T 8888 Wrough heavy non-ferrous metal products - Packing, marking, transportation, storing and certificate of quality
GB/T 29847-2013 Test methods for copper foil used for printed boards
3 Terms and definitions
For the purposes of this standard, the terms and definitions given in GB/T 2036 and the following apply.
3.1
elongation
ratio (expressed by percent) of the distance increment between the effective part markers of the specimen to that between the initial markers when the specimen breaks under tensile load
[GB/T 31471-2015, Definition 3.1]
3.2
foil profile
unevenness of a copper foil surface caused by processing and/or enhanced bonding treatment
[GB/T 31471-2015, Definition 3.4]
3.3
arithmetical mean deviation of the profile
Ra
arithmetic mean of the absolute distances from the center line to the rough profile within the measured length
[GB/T 31471-2015, Definition 3.5]
3.4
ten point height of irregularities
Rz
sum of the 5 largest profile peak height averages and the 5 largest profile valley depth averages within the sampled length
3.5
smooth side
cathode surface, i.e. the side of an electrodeposited copper foil close to the cathode roll
[GB/T 31471-2015, Definition 3.7]
3.6
matte side
the other side corresponding to the smooth side of an electrodeposited copper foil
[GB/T 31471-2015, Definition 3.8]
3.7
treatment transfer
enhancing binder transferred from the copper foil roughening treatment surface to the laminate substrate
3.8
carrier
support medium used to make thin or soft copper foils easy to process and use
3.9
copper foil with releasable carrier
copper foil produced by electrodeposition method using a carrier as a cathode
Note: copper foils with releasable carrier are mainly classified into etchable ones and detachable ones.
3.10
pinhole
light-transmitting micro holes through a copper foil
3.11
penetrating point
opaque pores
3.12
warpage
degree of bending of a copper foil specimen relative to the horizontal surface, characterized by the maximum vertical distance (mm) between the warped surface and the horizontal surface
4 Classification, designation and labeling
4.1 Classification
Copper foils are classified into 5 types by their characteristics, and their models and characteristics are shown in Table 1.
Table 1 Models and characteristics of copper foils
Model Characteristic
E-01 Standard electrodeposited copper foil
E-02 High-elongation electrodeposited copper foil
E-03 High-temperature-elongation electrodeposited copper foil
E-04 Annealable electrodeposited copper foil
E-05 Low-temperature-annealable electrodeposited copper foil
Note: the comparison table of electrodeposited copper foil models between this standard and foreign standards is detailed in Annex A.
4.2 Designation
4.2.1 Types of enhancing bonding treatment for copper foils
The types of enhancing bonding treatments for copper foils may include:
a) non-enhancing bonding treatment without anti-oxidation treatment, denoted by N;
b) non-enhancing bonding treatment with dual-side anti-oxidation treatment, denoted by P;
c) enhancing bonding treatment of matte side (anodic side) with dual-side anti-oxidation treatment, denoted by A;
d) enhancing bonding treatment of both sides with dual-side anti-oxidation treatment, denoted by D;
e) enhancing bonding treatment of smooth side (cathode side) with dual-side anti-oxidation treatment, denoted by R.
Contents of GB/T 5230-2020
Foreword i
1 Scope
2 Normative references
3 Terms and definitions
4 Classification, designation and labeling
4.1 Classification
4.2 Designation
4.3 Labeling
5 Technical requirements
5.1 Appearance quality
5.2 Dimensions and their allowable deviations
5.3 Physical properties
5.4 Processing property
5.5 Purity
5.6 Mass resistivity
6 Test methods
6.1 Appearance quality
6.2 Dimensions and their allowable deviations
6.3 Physical properties
6.4 Processing properties
6.5 Purity
6.6 Mass resistivity
7 Inspection rules
7.1 Inspection and acceptance
7.2 Inspection classification
7.3 Test conditions
7.4 Appraisal inspection (type inspection)
7.5 Quality conformance inspection
8 Marking, packaging, transportation, storage and quality certificate
8.1 Marking
8.2 Packaging
8.3 Transportation, storage and quality certificate
9 Order form (or contract) contents
Annex A (Informative) Comparison of electrodeposited copper foil models between this standard and foreign standards
Annex B (Normative) Test methods for diameter and quantity of copper powder
Annex C (Normative) Measurement method of warpage of copper foil
Bibliography
