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Position: Chinese Standard in English/GB/T 6616-1995
GB/T 6616-1995   Test method for measuring resistivity of semiconductor silicon or sheet resistance of semiconductor films with a noncontact eddy-current gage (English Version)
Standard No.: GB/T 6616-1995 Status:superseded remind me the status change

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Target Language:English File Format:PDF
Word Count: 3000 words Translation Price(USD):260.0 remind me the price change

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Implemented on:1995-1-2 Delivery: via email in 1~3 business day

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,2010-6-1,1995-1-2,DA8848CE1A9AE1031513905391476
Standard No.: GB/T 6616-1995
English Name: Test method for measuring resistivity of semiconductor silicon or sheet resistance of semiconductor films with a noncontact eddy-current gage
Chinese Name: 半导体硅片电阻率及硅薄膜薄层电阻测定 非接触涡流法
Chinese Classification: H21    Metal physical property test method
Professional Classification: GB    National Standard
Source Content Issued by: China State Bureau of Technical Supervision
Issued on: 1995-04-18
Implemented on: 1995-1-2
Status: superseded
Superseded by:GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge
Superseded on:2010-6-1
Superseding:GB 6616-1986 Standard method for measuring resistivity of silicon slices by noncontacting technique
Target Language: English
File Format: PDF
Word Count: 3000 words
Translation Price(USD): 260.0
Delivery: via email in 1~3 business day
本标准规定了硅片体电阻率和硅薄膜薄层电阻的非接触涡流测量方法。本标准适用于测量直径或边长大于30mm、厚度为0.1~1mm的硅单晶切割片、研磨片和抛光片(简称硅片)的电阻率及硅薄膜的薄层电阻。
Code of China
Standard
GB/T 6616-1995  Test method for measuring resistivity of semiconductor silicon or sheet resistance of semiconductor films with a noncontact eddy-current gage (English Version)
Standard No.GB/T 6616-1995
Statussuperseded
LanguageEnglish
File FormatPDF
Word Count3000 words
Price(USD)260.0
Implemented on1995-1-2
Deliveryvia email in 1~3 business day
Detail of GB/T 6616-1995
Standard No.
GB/T 6616-1995
English Name
Test method for measuring resistivity of semiconductor silicon or sheet resistance of semiconductor films with a noncontact eddy-current gage
Chinese Name
半导体硅片电阻率及硅薄膜薄层电阻测定 非接触涡流法
Chinese Classification
H21
Professional Classification
GB
ICS Classification
Issued by
China State Bureau of Technical Supervision
Issued on
1995-04-18
Implemented on
1995-1-2
Status
superseded
Superseded by
GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge
Superseded on
2010-6-1
Abolished on
Superseding
GB 6616-1986 Standard method for measuring resistivity of silicon slices by noncontacting technique
Language
English
File Format
PDF
Word Count
3000 words
Price(USD)
260.0
Keywords
GB/T 6616-1995, GB 6616-1995, GBT 6616-1995, GB/T6616-1995, GB/T 6616, GB/T6616, GB6616-1995, GB 6616, GB6616, GBT6616-1995, GBT 6616, GBT6616
Introduction of GB/T 6616-1995
本标准规定了硅片体电阻率和硅薄膜薄层电阻的非接触涡流测量方法。本标准适用于测量直径或边长大于30mm、厚度为0.1~1mm的硅单晶切割片、研磨片和抛光片(简称硅片)的电阻率及硅薄膜的薄层电阻。
Contents of GB/T 6616-1995
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Keywords:
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