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Position: Chinese Standard in English/GB/T 6619-1995
GB/T 6619-1995   Test methods for bow of silicon slices (English Version)
Standard No.: GB/T 6619-1995 Status:superseded remind me the status change

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Target Language:English File Format:PDF
Word Count: 3000 words Translation Price(USD):260.0 remind me the price change

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Implemented on:1995-1-2 Delivery: via email in 1~3 business day

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,2010-6-1,1995-1-2,68828B6EA17227621513905392370
Standard No.: GB/T 6619-1995
English Name: Test methods for bow of silicon slices
Chinese Name: 硅片弯曲度测试方法
Chinese Classification: H21    Metal physical property test method
Professional Classification: GB    National Standard
Source Content Issued by: China State Bureau of Technical Supervision
Issued on: 1995-04-18
Implemented on: 1995-1-2
Status: superseded
Superseded by:GB/T 6619-2009 Test methods for bow of silicon wafers
Superseded on:2010-6-1
Superseding:GB 6619-1986 Standard method for measuring bow of silicon slices
Target Language: English
File Format: PDF
Word Count: 3000 words
Translation Price(USD): 260.0
Delivery: via email in 1~3 business day
本标准规定了硅单晶切割片、研磨片、抛光片弯曲度的接触式测量方法。本标准适用于测量直径大于50mm,厚度为200~1000μm的圆形硅片的弯曲度。本标准也适用于测量其他半导体圆片弯曲度。
Code of China
Standard
GB/T 6619-1995  Test methods for bow of silicon slices (English Version)
Standard No.GB/T 6619-1995
Statussuperseded
LanguageEnglish
File FormatPDF
Word Count3000 words
Price(USD)260.0
Implemented on1995-1-2
Deliveryvia email in 1~3 business day
Detail of GB/T 6619-1995
Standard No.
GB/T 6619-1995
English Name
Test methods for bow of silicon slices
Chinese Name
硅片弯曲度测试方法
Chinese Classification
H21
Professional Classification
GB
ICS Classification
Issued by
China State Bureau of Technical Supervision
Issued on
1995-04-18
Implemented on
1995-1-2
Status
superseded
Superseded by
GB/T 6619-2009 Test methods for bow of silicon wafers
Superseded on
2010-6-1
Abolished on
Superseding
GB 6619-1986 Standard method for measuring bow of silicon slices
Language
English
File Format
PDF
Word Count
3000 words
Price(USD)
260.0
Keywords
GB/T 6619-1995, GB 6619-1995, GBT 6619-1995, GB/T6619-1995, GB/T 6619, GB/T6619, GB6619-1995, GB 6619, GB6619, GBT6619-1995, GBT 6619, GBT6619
Introduction of GB/T 6619-1995
本标准规定了硅单晶切割片、研磨片、抛光片弯曲度的接触式测量方法。本标准适用于测量直径大于50mm,厚度为200~1000μm的圆形硅片的弯曲度。本标准也适用于测量其他半导体圆片弯曲度。
Contents of GB/T 6619-1995
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Keywords:
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