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Position: Chinese Standard in English/GB/T 6619-2009
GB/T 6619-2009   Test methods for bow of silicon wafers (English Version)
Standard No.: GB/T 6619-2009 Status:valid remind me the status change

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Target Language:English File Format:PDF
Word Count: 6000 words Translation Price(USD):180.0 remind me the price change

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Implemented on:2010-6-1 Delivery: via email in 1~3 business day

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Standard No.: GB/T 6619-2009
English Name: Test methods for bow of silicon wafers
Chinese Name: 硅片弯曲度测试方法
Chinese Classification: H80    Semimetal and semiconductor material in general
Professional Classification: GB    National Standard
ICS Classification: 29.045 29.045    Semiconducting materials 29.045
Source Content Issued by: AQSIQ; SAC
Issued on: 2009-10-30
Implemented on: 2010-6-1
Status: valid
Superseding:GB/T 6619-1995 Test methods for bow of silicon slices
GB/T 16619-1996 Tree seed collection
Target Language: English
File Format: PDF
Word Count: 6000 words
Translation Price(USD): 180.0
Delivery: via email in 1~3 business day
本标准规定了硅单晶切割片?研磨片?抛光片(以下简称硅片)弯曲度的接触式测量方法?
本标准适用于测量直径不小于25mm,厚度为不小于180μm,直径和厚度比值不大于250的圆形硅片的弯曲度?本测试方法的目的是用于来料验收和过程控制?本标准也适用于测量其他半导体圆片
弯曲度?
Code of China
Standard
GB/T 6619-2009  Test methods for bow of silicon wafers (English Version)
Standard No.GB/T 6619-2009
Statusvalid
LanguageEnglish
File FormatPDF
Word Count6000 words
Price(USD)180.0
Implemented on2010-6-1
Deliveryvia email in 1~3 business day
Detail of GB/T 6619-2009
Standard No.
GB/T 6619-2009
English Name
Test methods for bow of silicon wafers
Chinese Name
硅片弯曲度测试方法
Chinese Classification
H80
Professional Classification
GB
ICS Classification
Issued by
AQSIQ; SAC
Issued on
2009-10-30
Implemented on
2010-6-1
Status
valid
Superseded by
Superseded on
Abolished on
Superseding
GB/T 6619-1995 Test methods for bow of silicon slices
GB/T 16619-1996 Tree seed collection
Language
English
File Format
PDF
Word Count
6000 words
Price(USD)
180.0
Keywords
GB/T 6619-2009, GB 6619-2009, GBT 6619-2009, GB/T6619-2009, GB/T 6619, GB/T6619, GB6619-2009, GB 6619, GB6619, GBT6619-2009, GBT 6619, GBT6619
Introduction of GB/T 6619-2009
本标准规定了硅单晶切割片?研磨片?抛光片(以下简称硅片)弯曲度的接触式测量方法?
本标准适用于测量直径不小于25mm,厚度为不小于180μm,直径和厚度比值不大于250的圆形硅片的弯曲度?本测试方法的目的是用于来料验收和过程控制?本标准也适用于测量其他半导体圆片
弯曲度?
Contents of GB/T 6619-2009
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Keywords:
GB/T 6619-2009, GB 6619-2009, GBT 6619-2009, GB/T6619-2009, GB/T 6619, GB/T6619, GB6619-2009, GB 6619, GB6619, GBT6619-2009, GBT 6619, GBT6619