GB/T 6619-2009 English Version, GB/T 6619-2009 Test methods for bow of silicon wafers (English Version)

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GB/T 6619-2009 Test methods for bow of silicon wafers (English Version)
Standard No.:	GB/T 6619-2009	Status:	valid remind me the status change Email:
Language:	English	File Format:	PDF
Word Count:	6000 words	Price(USD):	180.0 remind me the price change Email:
Implemented on:	2010-6-1	Delivery:	via email in 1~3 business day

Standard No.:	GB/T 6619-2009
English Name:	Test methods for bow of silicon wafers
Chinese Name:	硅片弯曲度测试方法
Chinese Classification:	H80 Semimetal and semiconductor material in general
Professional Classification:	GB National Standard
ICS Classification:	29.045 29.045 Semiconducting materials 29.045
Issued by:	AQSIQ; SAC
Issued on:	2009-10-30
Implemented on:	2010-6-1
Status:	valid
Superseding:	GB/T 6619-1995 Test methods for bow of silicon slices GB/T 16619-1996 Tree seed collection
Language:	English
File Format:	PDF
Word Count:	6000 words
Price(USD):	180.0
Delivery:	via email in 1~3 business day

Standard

GB/T 6619-2009 Test methods for bow of silicon wafers (English Version)
Standard No.	GB/T 6619-2009
Status	valid
Language	English
File Format	PDF
Word Count	6000 words
Price(USD)	180.0
Implemented on	2010-6-1
Delivery	via email in 1~3 business day

Detail of GB/T 6619-2009

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ICS Classification

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Introduction of GB/T 6619-2009

本标准规定了硅单晶切割片?研磨片?抛光片(以下简称硅片)弯曲度的接触式测量方法?
本标准适用于测量直径不小于25mm,厚度为不小于180μm,直径和厚度比值不大于250的圆形硅片的弯曲度?本测试方法的目的是用于来料验收和过程控制?本标准也适用于测量其他半导体圆片
弯曲度?

Contents of GB/T 6619-2009

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Keywords:
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