GB/T 8750-2007 English Version, GB/T 8750-2007 Gold bonding wire for semiconductor devices (English Version) - Code of China
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Position: Chinese Standard in English/GB/T 8750-2007
GB/T 8750-2007   Gold bonding wire for semiconductor devices (English Version)
Standard No.: GB/T 8750-2007 Status:superseded
Language:English File Format:PDF
Word Count: 8000 words Price(USD):240.00 remind me the price change
Implemented on:2008-6-1 Delivery: via email in 1~3 business day
Standard No.: GB/T 8750-2007
English Name: Gold bonding wire for semiconductor devices
Chinese Name: 半导体器件键合用金丝
Chinese Classification: H68    Precious metals and their alloys
Professional Classification: GB    National Standard
ICS Classification: 77.150.99 77.150.99    Other products of non-ferrous metals 77.150.99
Issued by: AQSIQ; SAC
Issued on: 1988-2-25
Implemented on: 2008-6-1
Status: superseded
Superseded by:GB/T 8750-2014 Gold bonding wire for semiconductor package
Superseded on:2015-2-1
Superseding:GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
Language: English
File Format: PDF
Word Count: 8000 words
Price(USD): 240.00
Delivery: via email in 1~3 business day
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