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| Position: Chinese Standard in English/GB/T 8750-2007 |
| GB/T 8750-2007 Gold bonding wire for semiconductor devices (English Version) | |||
| Standard No.: | GB/T 8750-2007 | Status: | superseded remind me the status change |
| Language: | English | File Format: | |
| Word Count: | 8000 words | Price(USD): | 240.0 remind me the price change |
| Implemented on: | 2008-6-1 | Delivery: | via email in 1~3 business day |
| Standard No.: | GB/T 8750-2007 |
| English Name: | Gold bonding wire for semiconductor devices |
| Chinese Name: | 半导体器件键合用金丝 |
| Chinese Classification: | H68 Precious metals and their alloys |
| Professional Classification: | GB National Standard |
| ICS Classification: | 77.150.99 Other products of non-ferrous metals |
| Issued by: | AQSIQ; SAC |
| Issued on: | 1988-2-25 |
| Implemented on: | 2008-6-1 |
| Status: | superseded |
| Superseded by: | GB/T 8750-2014 Gold bonding wire for semiconductor package |
| Superseded on: | 2015-2-1 |
| Superseding: | GB/T 8750-1997 Gold wire for semiconductor devices lead bonding |
| Language: | English |
| File Format: | |
| Word Count: | 8000 words |
| Price(USD): | 240.0 |
| Delivery: | via email in 1~3 business day |