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Standard
| GB/T 8750-2014 Gold bonding wire for semiconductor package (English Version) |
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Detail of GB/T 8750-2014
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Introduction of GB/T 8750-2014
本标准规定了半导体分立器件、集成电路、LED 封装用键合金丝(以下简称金丝)的要求、试验方法、检验规则、标志、包装、运输和贮存、质量证明书、合同(或订货单)等内容。
本标准适用于半导体封装用键合金丝。
Contents of GB/T 8750-2014