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| Position: Chinese Standard in English/YS/T 543-2006 |
| YS/T 543-2006 Fine aluminum-1% silicon wire for semiconductor lend-bonding (English Version) | |||
| Standard No.: | YS/T 543-2006 | Status: | superseded |
| Language: | English | File Format: | |
| Word Count: | 3500 words | Price(USD): | 100.00 remind me the price change |
| Implemented on: | 2006-10-11 | Delivery: | via email in 1~3 business day |
| Standard No.: | YS/T 543-2006 |
| English Name: | Fine aluminum-1% silicon wire for semiconductor lend-bonding |
| Chinese Name: | 半导体键合铝-1%硅细丝 |
| Chinese Classification: | H8 |
| Professional Classification: | YS Professional Standard - Non-ferrous Metal |
| ICS Classification: | 29.045 Semiconducting materials |
| Issued on: | 2006-7-27 |
| Implemented on: | 2006-10-11 |
| Status: | superseded |
| Superseded by: | YS/T 543-2015 Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding |
| Superseded on: | 2015-10-1 |
| Superseding: | GB/T 8646-1998 Fine aluminum-1% silicon wire for semiconductor lend-bonding |
| Language: | English |
| File Format: | |
| Word Count: | 3500 words |
| Price(USD): | 100.00 |
| Delivery: | via email in 1~3 business day |