2026-1-23 10.1.194.235
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
GB/T 4937.44-2025 Semiconductor devices—Mechanical and climatic test methods—Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices 255.0 via email in 1~3 business day to be valid,,2026-7-1
GB/T 4937.33-2025 Semiconductor devices—Mechanical and climatic test methods—Part 33: Accelerated moisture resistance—Unbiased autoclave 165.0 via email in 1~3 business day to be valid,,2026-7-1
GB/T 4937.38-2025 Semiconductor devices—Mechanical and climatic test methods—Part 38: Soft error test method for semiconductor devices with memory 225.0 via email in 1~3 business day to be valid,,2026-7-1
GB/T 4937.36-2025 Semiconductor devices—Mechanical and climatic test methods—Part 36:Acceleration，steady state 165.0 via email in 1~3 business day to be valid,,2026-7-1
GB/T 4937.16-2025 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection(PIND) 270.0 via email in 1~3 business day to be valid,,2026-5-1
GB/T 45720-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for gate dielectric films 375.0 via email in 1~5 business day valid,,2025-9-1
GB/T 45721.1-2025 Semiconductor devices—Stress migration test—Part 1: Copper stress migration test 435.0 via email in 1~5 business day valid,,2025-9-1
GB/T 45722-2025 Semiconductor devices—Constant current electromigration test 270.0 via email in 1~3 business day valid,,2025-9-1
GB/T 45719-2025 Semiconductor devices—Hot carrier test on metal-oxide semiconductor(MOS) transistors 270.0 via email in 1~3 business day valid,,2025-9-1
GB/T 45718-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for inter-metal layers 315.0 via email in 1~5 business day valid,,2025-9-1
GB/T 45716-2025 Semiconductor devices—Bias temperature instability test for metal-oxide semiconductor field-effect transistors (MOSFETs) 270.0 via email in 1~3 business day valid,,2025-9-1
GB/T 20870.4-2024 Semiconductor devices—Part 16-4：Microwave intergrated circuits—Switches 435.0 via email in 1~5 business day valid,,2024-10-26
GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components 330.0 via email in 1~3 business day valid,,2024-7-1
GB/T 4937.34-2024 Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling 210.0 via email in 1~3 business day valid,,2024-7-1
GB/T 4937.26-2023 Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM） 800.0 via email in 1~5 business day valid,,2024-4-1
T/CEPEA 0101-2023 X-ray real-time imaging detection method for IGBT module welding quality 420.0 via email in 1~5 business day valid,,2024-3-15
T/SLEIA 0003-2024 via email in business day valid,,2024-2-26
GB/T 20870.5-2023 Semiconductor devices—Part 16-5: Microwave integrated circuits—Oscillators 600.0 via email in 1~5 business day valid,,2024-1-1
GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27: Electrostatic discharge(ESD) sensitivity testing—Machine model(MM) 255.0 via email in 1~3 business day valid,,2023-12-1
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life 255.0 via email in 1~3 business day valid,,2023-12-1
Previous Page     Next Page



Code of China
Search

GB/T 4937.44-2025 Semiconductor devices—Mechanical and climatic test methods—Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices 
  Issued on: 2025-12-2   Price(USD): 255.0
GB/T 4937.33-2025 Semiconductor devices—Mechanical and climatic test methods—Part 33: Accelerated moisture resistance—Unbiased autoclave 
  Issued on: 2025-12-2   Price(USD): 165.0
GB/T 4937.38-2025 Semiconductor devices—Mechanical and climatic test methods—Part 38: Soft error test method for semiconductor devices with memory 
  Issued on: 2025-12-2   Price(USD): 225.0
GB/T 4937.36-2025 Semiconductor devices—Mechanical and climatic test methods—Part 36:Acceleration，steady state 
  Issued on: 2025-12-2   Price(USD): 165.0
GB/T 4937.16-2025 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection(PIND) 
  Issued on: 2025-10-31   Price(USD): 270.0
GB/T 45720-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for gate dielectric films 
  Issued on: 2025-05-30   Price(USD): 375.0
GB/T 45721.1-2025 Semiconductor devices—Stress migration test—Part 1: Copper stress migration test 
  Issued on: 2025-05-30   Price(USD): 435.0
GB/T 45722-2025 Semiconductor devices—Constant current electromigration test 
  Issued on: 2025-05-30   Price(USD): 270.0
GB/T 45719-2025 Semiconductor devices—Hot carrier test on metal-oxide semiconductor(MOS) transistors 
  Issued on: 2025-05-30   Price(USD): 270.0
GB/T 45718-2025 Semiconductor devices—Time dependent dielectric breakdown (TDDB) test for inter-metal layers 
  Issued on: 2025-05-30   Price(USD): 315.0
GB/T 45716-2025 Semiconductor devices—Bias temperature instability test for metal-oxide semiconductor field-effect transistors (MOSFETs) 
  Issued on: 2025-05-30   Price(USD): 270.0
GB/T 20870.4-2024 Semiconductor devices—Part 16-4：Microwave intergrated circuits—Switches 
  Issued on: 2024-10-26   Price(USD): 435.0
GB/T 4937.35-2024 Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components 
  Issued on: 2024-3-15   Price(USD): 330.0
GB/T 4937.34-2024 Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling 
  Issued on: 2024-3-15   Price(USD): 210.0
GB/T 4937.26-2023 Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM） 
  Issued on: 2023-9-7   Price(USD): 800.0
T/CEPEA 0101-2023 X-ray real-time imaging detection method for IGBT module welding quality 
  Issued on: 2024-03-01   Price(USD): 420.0
T/SLEIA 0003-2024  
  Issued on: 2024-01-26   Price(USD):
GB/T 20870.5-2023 Semiconductor devices—Part 16-5: Microwave integrated circuits—Oscillators 
  Issued on: 2023-9-7   Price(USD): 600.0
GB/T 4937.27-2023 Semiconductor devices—Mechanical and climatic test methods—Part 27: Electrostatic discharge(ESD) sensitivity testing—Machine model(MM)  
  Issued on: 2023-05-23   Price(USD): 255.0
GB/T 4937.23-2023 Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life 
  Issued on: 2023-05-23   Price(USD): 255.0
About Us   |    Contact Us   |    Terms of Service   |    Privacy   |    Cancellation & Refund Policy   |    Payment
Contact us via WeChat
Tel: +86-10-8572 5655 | Fax: +86-10-8581 9515 | Email: coc@codeofchina.com | QQ: 3680948734
Copyright: Beijing COC Tech Co., Ltd. 2008-2040