2025-12-6 10.1.6.65
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop 255.0 via email in 1~3 business day valid,,2022-10-1
T/GITIF 007-2021 Fault prediction technical specification for complex equipments based on Maintenance, Repair and Overhaul/Operation（MRO） requirements via email in business day valid,,2021-12-30
T/GITIF 008-2021 Predictive maintenance technical specification for complex equipments based on Maintenance, Repair and Overhaul/Operation（MRO） requirements via email in business day valid,,2021-12-30
JB/T 5842-2005 Rings for dies of semiconductor devices 150.0 via email in 1~3 business day valid,,2005-9-1
JB/T 5835-2005 Components of gate terminal for power semiconductor devices 244.0 via email in 1~3 business day valid,,2005-9-1
SJ/T 11187-1998 General specification for surface mounting adhesives 220.0 via email in 1~3 business day superseded2023-11-01,2023-11-1,1998-5-1
SJ/T 11186-1998 General specifications for tin-lead soldering pastes 650.0 via email in 1~3 business day superseded2010-01-01 ,2010-1-1,1998-5-1
SJ/Z 3220-1989 Edited figures for typical structures of cabinets and cases made of aluminium alloys 570.0 via email in 1~3 business day valid,,1989-3-1
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GB/T 8446.2-2022 Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop 
  Issued on: 2022-03-09   Price(USD): 255.0
T/GITIF 007-2021 Fault prediction technical specification for complex equipments based on Maintenance, Repair and Overhaul/Operation（MRO） requirements 
  Issued on: 2021-12-30   Price(USD):
T/GITIF 008-2021 Predictive maintenance technical specification for complex equipments based on Maintenance, Repair and Overhaul/Operation（MRO） requirements 
  Issued on: 2021-12-30   Price(USD):
JB/T 5842-2005 Rings for dies of semiconductor devices 
  Issued on: 2005-3-19   Price(USD): 150.0
JB/T 5835-2005 Components of gate terminal for power semiconductor devices 
  Issued on: 2005-3-19   Price(USD): 244.0
SJ/T 11187-1998 General specification for surface mounting adhesives 
  Issued on: 1998-03-11   Price(USD): 220.0
SJ/T 11186-1998 General specifications for tin-lead soldering pastes 
  Issued on: 1998-03-11   Price(USD): 650.0
SJ/Z 3220-1989 Edited figures for typical structures of cabinets and cases made of aluminium alloys 
  Issued on: 1989-02-10   Price(USD): 570.0
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