2025-12-5 10.1.6.65
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
Position: Search valid to be valid superseded to be superseded abolished to be abolished
Standard No. Title Price(USD) Delivery Status Add to Cart
T/CARP 0019-2023 via email in business day valid,,2024-1-1
T/CSTM 01700-2025 Management specification for revert wrought superalloys for aerospace applications via email in business day valid,,2025-5-1
T/CCMI 35-2025 Management specification for revert wrought superalloys for aerospace applications via email in business day valid,,2025-5-1
QJ 977B-2005 Rule for Re-inspection of Non-metallic Materials 615.0 via email in 1~5 business day valid,,2006-5-1
GB/Z 41275.4-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array（BGA）re-balling 615.0 via email in 1~3 business day valid,,2024-7-1
GB/Z 41275.23-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies 555.0 via email in 1~3 business day valid,,2024-7-1
GB/Z 41275.22-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22: Technical guidelines 810.0 via email in 1~5 business day valid,,2024-7-1
GB/T 42846-2023 Space environment—Method of ground simulation for space radiation effect on non-metallic materials 375.0 via email in 1~5 business day valid,,2023-8-6
GB/T 41886-2022 Requirements for cabin acoustic design of transport aircraft 315.0 via email in 1~5 business day valid,,2022-10-12
GB/T 41275.21-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 21：Guidelines for transition to lead-free electronics 435.0 via email in 1~5 business day valid,,2022-10-1
GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3:Performance testing for systems containing lead-free solder and finishes 435.0 via email in 1~5 business day valid,,2022-10-1
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2：Mitigation of deleterious effects of tin 825.0 via email in 1~5 business day valid,,2022-10-1
GB/T 41215-2021 Space materials science experiment―Ground-based matching test specification 225.0 via email in 1~3 business day valid,,2022-7-1
QJ 3090-1999 Re-Inspection Rules for Welding Materials 570.0 via email in 1~5 business day valid,,1999-7-1
QJ 3178-2003 Technical requirements for non-destructive testing of astronautic material and parts assemblies(subassemblies) 150.0 via email in 1~3 business day valid,,2003-12-1
QJ A 547-1998 via email in business day valid,,
QJ 1280-1987 Technical Specification for RTV Silicon Rubber Glass Cloth 75.0 via email in 1~3 business day valid,,1988-3-1
QJ 2136.4-1991 180.0 via email in 1~3 business day valid,,1991-11-1
QJ 2196-1991 120.0 via email in 1~3 business day valid,,1991-10-1
QJ 3177-2003 Test method for determining sensitivety of materials to mechanical impact in liquid oxygen and pressurized oxygen environment 300.0 via email in 1~3 business day valid,,2003-12-1
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T/CARP 0019-2023  
  Issued on: 2023-12-15   Price(USD):
T/CSTM 01700-2025 Management specification for revert wrought superalloys for aerospace applications 
  Issued on: 2025-04-14   Price(USD):
T/CCMI 35-2025 Management specification for revert wrought superalloys for aerospace applications 
  Issued on: 2025-04-14   Price(USD):
QJ 977B-2005 Rule for Re-inspection of Non-metallic Materials 
  Issued on:   Price(USD): 615.0
GB/Z 41275.4-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array（BGA）re-balling 
  Issued on: 2023-12-28   Price(USD): 615.0
GB/Z 41275.23-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies 
  Issued on: 2023-12-28   Price(USD): 555.0
GB/Z 41275.22-2023 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 22: Technical guidelines 
  Issued on: 2023-12-28   Price(USD): 810.0
GB/T 42846-2023 Space environment—Method of ground simulation for space radiation effect on non-metallic materials 
  Issued on: 2023-08-06   Price(USD): 375.0
GB/T 41886-2022 Requirements for cabin acoustic design of transport aircraft 
  Issued on: 2022-10-12   Price(USD): 315.0
GB/T 41275.21-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 21：Guidelines for transition to lead-free electronics  
  Issued on: 2022-03-09   Price(USD): 435.0
GB/T 41275.3-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3:Performance testing for systems containing lead-free solder and finishes 
  Issued on: 2022-03-09   Price(USD): 435.0
GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2：Mitigation of deleterious effects of tin  
  Issued on: 2022-03-09   Price(USD): 825.0
GB/T 41215-2021 Space materials science experiment―Ground-based matching test specification 
  Issued on: 2021-12-31   Price(USD): 225.0
QJ 3090-1999 Re-Inspection Rules for Welding Materials  
  Issued on: 1999-02-10   Price(USD): 570.0
QJ 3178-2003 Technical requirements for non-destructive testing of astronautic material and parts assemblies(subassemblies) 
  Issued on: 2003-9-25   Price(USD): 150.0
QJ A 547-1998  
  Issued on:   Price(USD):
QJ 1280-1987 Technical Specification for RTV Silicon Rubber Glass Cloth  
  Issued on: 1987-07-15   Price(USD): 75.0
QJ 2136.4-1991  
  Issued on: 1991-02-05   Price(USD): 180.0
QJ 2196-1991  
  Issued on: 1991-02-28   Price(USD): 120.0
QJ 3177-2003 Test method for determining sensitivety of materials to mechanical impact in liquid oxygen and pressurized oxygen environment 
  Issued on: 2003-9-25   Price(USD): 300.0
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