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Chinese Standard Classification
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| Position: Search | valid to be valid superseded to be superseded abolished to be abolished |
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T/CPCA 004-2020 General specification of tungsten carbide routers and endmills for printed circuit boards
Issued on: 2020-01-10 Price(USD): |
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T/CPCA 014-2024 Specification of OSP film for printed circuit board
Issued on: 2024-08-30 Price(USD): |
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T/CPCA 011-2023 Single & double-sided printed circuit board with carbon conductor
Issued on: 2023-06-28 Price(USD): |
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T/CPCA 013-2024 Tungsten carbide drills for printed boards
Issued on: 2024-03-28 Price(USD): |
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T/CPCA 005-2020 Fire prevention specification of printed circuit board factories
Issued on: 2020-09-30 Price(USD): |
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T/CPCA 010-2023 Silver pasted through-hole printed circuit board
Issued on: 2023-05-05 Price(USD): |
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T/CPCA 007-2022 Specification for printed circuit board with buried or embedded copper coin
Issued on: 2022-06-23 Price(USD): |
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T/CPCA 006-2021 Flexible and rigid-flexible printed circuit board
Issued on: 2021-10-08 Price(USD): |
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GB/T 46821-2025 Test methods for device embedded substrate
Issued on: 2025-12-31 Price(USD): 645.0 |
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GB/T 33772.3-2025 Quality assessment systems—Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Issued on: 2025-12-31 Price(USD): 660.0 |
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GB/T 19405.4-2025 Surface mounting technology—Part 4: Classification; packaging; labelling and handling of moisture sensitive devices
Issued on: 2025-12-31 Price(USD): 435.0 |
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T/TMAC 139-2025
Issued on: Price(USD): |
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GB/T 46696-2025 Specification for permanent solder mask
Issued on: 2025-12-2 Price(USD): 315.0 |
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GB/T 45723-2025 Test method for printed board—Monitoring of single plated-through hole(PTH) resistance change during temperature cycling
Issued on: 2025-05-30 Price(USD): 210.0 |
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GB/T 45714.54-2025 Printed circuit board materials—Part 5-4:Sectional specification set for conductive foils and films with or without coatings—Conductive pastes
Issued on: 2025-05-30 Price(USD): 375.0 |
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GB/T 45713.4-2025 Electronics assembly technology—Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Issued on: 2025-05-30 Price(USD): 645.0 |
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GB/T 45660-2025 Electronics assembly technology—Electronic modules
Issued on: 2025-05-30 Price(USD): 315.0 |
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GB/T 33772.2-2025 Quality assessment systems —Part 2: Selection and use of sampling plans for inspection of electronic components and packages
Issued on: 2025-05-30 Price(USD): 315.0 |
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GB/T 19405.3-2025 Surface mounting technology—Part 3:Standard method for the specification of components for through hole reflow(THR)soldering
Issued on: 2025-04-25 Price(USD): 375.0 |
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JB 8202-1995 Multilayer Printed adhesive prepreg sheet
Issued on: Price(USD): |
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