2025-12-22 216.73.216.41
Code of China Chinese Standard Classification Professional Classification ICS Classification Latest
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Standard No. Title Price(USD) Delivery Status Add to Cart
GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices（externally induced） 120.0 via email in 1~3 business day valid,,2023-12-1
GB/T 4937.31-2023 Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices（internally induced） 120.0 via email in 1~3 business day valid,,2023-12-1
GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage 180.0 via email in 1~3 business day valid,,2023-12-1
GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 430.0 via email in 1~5 business day valid,,2019-1-1
GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30:Preconditioning of non-hermetic surface mount devices prior to reliability testing 130.0 via email in 1~3 business day valid,,2019-1-1
GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength 250.0 via email in 1~3 business day valid,,2019-1-1
GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength 80.0 via email in 1~3 business day valid,,2019-1-1
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 250.0 via email in 1~3 business day valid,,2019-1-1
GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 310.0 via email in 1~5 business day valid,,2019-1-1
GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18:Ionizing radiation(total dose) 130.0 via email in 1~3 business day valid,,2019-1-1
GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17:Neutron irradiation 80.0 via email in 1~3 business day valid,,2019-1-1
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices 80.0 via email in 1~3 business day valid,,2019-1-1
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity） 160.0 via email in 1~3 business day valid,,2019-1-1
GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere 80.0 via email in 1~3 business day valid,,2019-1-1
GB/T 4937.12-2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency 80.0 via email in 1~3 business day valid,,2019-1-1
GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method 80.0 via email in 1~3 business day valid,,2019-1-1
T/IAWBS 004-2017 255.0 via email in 1~3 business day valid,,2017-12-31
DB52/T 1104-2016 Junction-to-case thermal resistance transient test method of semiconductor devices via email in business day valid,,2016-10-1
SJ 20961-2006 General principles of measuring methods of A/D and D/A converters for integrated circuits 400.0 via email in 1~3 business day valid,,2006-12-30
JB/T 10096-2000 Selection guidance of case for power semiconductor device 100.0 via email in 1~3 business day valid,,2000-10-1
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GB/T 4937.32-2023 Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices（externally induced）  
  Issued on: 2023-05-23   Price(USD): 120.0
GB/T 4937.31-2023 Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices（internally induced）  
  Issued on: 2023-05-23   Price(USD): 120.0
GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage 
  Issued on: 2023-05-23   Price(USD): 180.0
GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 
  Issued on: 2018-09-17   Price(USD): 430.0
GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30:Preconditioning of non-hermetic surface mount devices prior to reliability testing 
  Issued on: 2018-09-17   Price(USD): 130.0
GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength 
  Issued on: 2018-09-17   Price(USD): 250.0
GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19:Die shear strength 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 
  Issued on: 2018-09-17   Price(USD): 250.0
GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 
  Issued on: 2018-09-17   Price(USD): 310.0
GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18:Ionizing radiation(total dose) 
  Issued on: 2018-09-17   Price(USD): 130.0
GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17:Neutron irradiation 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15:Resistance to soldering temperature for through-hole mounted devices 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14:Robustness of terminations(lead integrity） 
  Issued on: 2018-09-17   Price(USD): 160.0
GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13:Salt atmosphere 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.12-2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency 
  Issued on: 2018-09-17   Price(USD): 80.0
GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11:Rapid change of temperature—Two-fluid-bath method 
  Issued on: 2018-09-17   Price(USD): 80.0
T/IAWBS 004-2017  
  Issued on: 2017-12-20   Price(USD): 255.0
DB52/T 1104-2016 Junction-to-case thermal resistance transient test method of semiconductor devices 
  Issued on: 2016-04-01   Price(USD):
SJ 20961-2006 General principles of measuring methods of A/D and D/A converters for integrated circuits 
  Issued on: 2006-8-7   Price(USD): 400.0
JB/T 10096-2000 Selection guidance of case for power semiconductor device 
  Issued on: 2000-4-24   Price(USD): 100.0
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